SCHEMBL28709592

SCHEMBL28709592

CCOCOCCCCOCC1(CC)COC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18510084 0.89 EPHX2 (0.31)
SCHEMBL18324307 0.89 EPHX2 (0.31)
SCHEMBL28325893 0.89 ALDH1A1 (0.31)
SCHEMBL35991 0.89 TSHR (0.33)
SCHEMBL31520167 0.87 HTT (0.31)
SCHEMBL1582321 0.87 ALDH1A1 (0.33)
SCHEMBL1594114 0.87 ALDH1A1 (0.33)
SCHEMBL12677034 0.87 ALDH1A1 (0.33)
SCHEMBL21396944 0.87 TSHR (0.32)
SCHEMBL14655776 0.87 ALDH1A1 (0.33)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115433146-A Compound for sealing film, composition and sealing film formed by using composition 西安思摩威新材料有限公司 2022-12-06 CN claimed
CN-115433146-A Compound for sealing film, composition and sealing film formed by using composition 西安思摩威新材料有限公司 2022-12-06 CN disclosed
CN-114196357-A Epoxy adhesive, packaging layer and application thereof 杭州福斯特电子材料有限公司 2022-03-18 CN disclosed