SCHEMBL2874656

SCHEMBL2874656

O=C(O)C1=C(C(=O)O)C(C(=O)O)(C(=O)O)C(C(=O)O)(C(=O)O)CC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Hydrochloric Acid SCHEMBL8987261 0.74
SCHEMBL3783619 0.71
SCHEMBL22077232 0.70 FFAR3 (0.39)
SCHEMBL3264588 0.64 CYP2C19 (0.30)
SCHEMBL9004834 0.62 CYP1A2 (0.40)
SCHEMBL29216142 0.62 FFAR3 (0.31)
SCHEMBL23501559 0.61 CCR2 (0.36)
SCHEMBL673146 0.61 KRAS (0.38)
SCHEMBL11762994 0.59 AKR1C1 (0.39)
Hydrochloric Acid SCHEMBL3142298 0.59 FFAR3 (0.44)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 78 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12516139-B2 Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2026-01-06 US disclosed
EP-4321541-B1 RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE MITSUBISHI GAS CHEMICAL CO (JP) 2025-08-06 EP disclosed
CN-119866352-A Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 日本化药株式会社 2025-04-22 CN disclosed
US-12221523-B2 Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2025-02-11 US disclosed
CN-117529509-B Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 三菱瓦斯化学株式会社 2025-01-10 CN disclosed
EP-4074740-B1 RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE MITSUBISHI GAS CHEMICAL CO (JP) 2024-11-20 EP disclosed
CN-117355545-B Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 三菱瓦斯化学株式会社 2024-10-18 CN disclosed
US-20240309127-A1 RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2024-09-19 US disclosed
US-20240287219-A1 RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2024-08-29 US disclosed
US-20240287347-A1 RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2024-08-29 US disclosed
EP-0532899-A1 Method for extending the potlife of polyol/polyisocyanate mixtures THE SHERWIN-WILLIAMS COMPANY (US) 1993-03-24 EP disclosed
US-5157100-A Blend with anhydride polymer THE SHERWIN-WILLIAMS COMPANY (US) 1992-10-20 US disclosed
US-5086144-A Low temperature curable clear coating THE SHERWIN-WILLIAMS COMPANY (US) 1992-02-04 US disclosed
US-5043220-A Clear coating on film forming polymer THE SHERWIN-WILLIAMS COMPANY (US) 1991-08-27 US disclosed
US-4946744-A Substrate coated with a clearcoat/basecoat composition comprising an anhydride-functional compound and an hydroxy-functional compound THE SHERWIN-WILLIAMS COMPANY (US) 1990-08-07 US disclosed
US-4871806-A FILN FORMING POLYMER; PROTECTIVE COATING THE SHERWIN-WILLIAMS COMPANY (US) 1989-10-03 US disclosed
US-4859758-A Acid-functional polymers derived from cellulose ester-unsaturated alcohol copolymers, which are reacted with cyclic anhydrides THE SHERWIN-WILLIAMS COMPANY (US) 1989-08-22 US disclosed
EP-0111965-B1 DETERGENT COMPOSITIONS CONTAINING CATIONIC COMPOUNDS HAVING CLAY SOIL REMOVAL/ANTI-REDEPOSITION PROPERTIES THE PROCTER &amp; GAMBLE COMPANY (US) 1989-07-26 EP disclosed
EP-0316874-A2 Reactive coatings THE SHERWIN-WILLIAMS COMPANY (US) 1989-05-24 EP disclosed
EP-0316873-A2 Reactive coatings comprising an acid-functional compound, an anhydride-functional compound, an epoxy-functional compound and a hydroxy-functional compound THE SHERWIN-WILLIAMS COMPANY (US) 1989-05-24 EP disclosed