SCHEMBL2881609

SCHEMBL2881609

CC=NCCC#N

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17985121 1.00
SCHEMBL17985105 0.84
SCHEMBL16620286 0.84
SCHEMBL17985106 0.80 TSHR (0.39)
SCHEMBL17985104 0.80 TSHR (0.39)
SCHEMBL2786444 0.77 ALDH1A1 (0.41)
SCHEMBL17985083 0.74
SCHEMBL17985082 0.74
SCHEMBL23913664 0.74
SCHEMBL2221796 0.72

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 37 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-101668627-B Metal surface treatment composition MACDERMID INC 2013-09-04 CN claimed
JP-2010525175-A 2010-07-22 JP claimed
CN-101668627-A Metal surface treatment composition MACDERMID INC 2010-03-10 CN claimed
US-7645393-B2 contacting Cu surface with a formulation containing copper chloride oxidizer, an organic acid or an inorganic acid;a source of halide ions such as Nacl, HCl, Hbr, KCl etc and poly(ethyleneamino propionitrile) polymer for roughening the copper surface; bonding a polymeric material to the metal surface CITIBANK, N.A. 2010-01-12 US claimed
EP-2132035-A1 METAL SURFACE TREATMENT COMPOSITION MACDERMID INCORPORATED (US) 2009-12-16 EP claimed
WO-2008133760-A1 METAL SURFACE TREATMENT COMPOSITION MACDERMID, INCORPORATED (US) 2008-11-06 WO claimed
EP-3052531-B1 POLYMERS FUNCTIONALIZED WITH IMINE COMPOUNDS CONTAINING A CYANO GROUP BRIDGESTONE CORP (JP) 2024-07-24 EP disclosed
US-20240136596-A1 LITHIUM BATTERY STRUCTURE AND ELECTRODE LAYER THEREOF PROLOGIUM TECHNOLOGY CO., LTD. (TW) 2024-04-25 US disclosed
US-11881560-B2 Lithium battery structure and electrode layer thereof PROLOGIUM TECHNOLOGY CO., LTD. (TW) 2024-01-23 US disclosed
EP-3819960-B1 LITHIUM BATTERY STRUCTURE AND ELECTRODE LAYER THEREOF PROLOGIUM TECH CO LTD (TW) 2023-12-06 EP disclosed
CN-112331906-B Active material ball layer structure 辉能科技股份有限公司 2022-08-05 CN disclosed
US-11205823-B2 Ceramic separator PROLOGIUM TECHNOLOGY CO., LTD. (TW) 2021-12-21 US disclosed
EP-3905410-A1 COMPOSITE SEPARATING LAYER Prologium Technology Co., Ltd. (TW) 2021-11-03 EP disclosed
US-7645393-B2 contacting Cu surface with a formulation containing copper chloride oxidizer, an organic acid or an inorganic acid;a source of halide ions such as Nacl, HCl, Hbr, KCl etc and poly(ethyleneamino propionitrile) polymer for roughening the copper surface; bonding a polymeric material to the metal surface CITIBANK, N.A. 2010-01-12 US disclosed
US-7645393-B2 contacting Cu surface with a formulation containing copper chloride oxidizer, an organic acid or an inorganic acid;a source of halide ions such as Nacl, HCl, Hbr, KCl etc and poly(ethyleneamino propionitrile) polymer for roughening the copper surface; bonding a polymeric material to the metal surface CITIBANK, N.A. 2010-01-12 US disclosed
EP-2132035-A1 METAL SURFACE TREATMENT COMPOSITION MACDERMID INCORPORATED (US) 2009-12-16 EP disclosed
EP-2132035-A1 METAL SURFACE TREATMENT COMPOSITION MACDERMID INCORPORATED (US) 2009-12-16 EP disclosed
WO-2008133760-A1 METAL SURFACE TREATMENT COMPOSITION MACDERMID, INCORPORATED (US) 2008-11-06 WO disclosed
WO-2008133760-A1 METAL SURFACE TREATMENT COMPOSITION MACDERMID, INCORPORATED (US) 2008-11-06 WO disclosed
EP-0815083-A1 N-AMINOPYRIDONE DERIVATIVES AND THEIR USE AS HERBICIDES BASF AKTIENGESELLSCHAFT (DE) 1998-01-07 EP disclosed