⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Itaconic Anhydride SCHEMBL25233 | 0.97 | — | — | |
| Itaconic Anhydride SCHEMBL4343089 | 0.94 | TSHR (0.32) | — | |
| Itaconic Anhydride SCHEMBL4821410 | 0.84 | — | — | |
| Itaconic Anhydride SCHEMBL16102144 | 0.79 | ALDH1A1 (0.42) | — | |
| Itaconic Anhydride SCHEMBL6931660 | 0.77 | — | — | |
| Itaconic Anhydride SCHEMBL17260877 | 0.76 | — | — | |
| Itaconic Anhydride SCHEMBL9347564 | 0.76 | — | — | |
| Itaconic Anhydride SCHEMBL8592967 | 0.76 | — | — | |
| SCHEMBL10631480 | 0.75 | — | — | |
| SCHEMBL13374676 | 0.74 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-104745108-B | The manufacturing method of semiconductor device resin film and semiconductor device | 日东电工株式会社 | 2019-11-22 | — | — | CN | disclosed |
| CN-104733400-B | Dicing/die bonding film, the manufacturing method of semiconductor device and semiconductor device | 日东电工株式会社 | 2019-05-07 | — | — | CN | disclosed |
| CN-109005668-A | Band used for sealing electronic device | 古河电气工业株式会社 | 2018-12-14 | — | — | CN | disclosed |
| CN-108885980-A | Band used for sealing electronic device | 古河电气工业株式会社 | 2018-11-23 | — | — | CN | disclosed |
| CN-108779375-A | Band used for sealing electronic device | 古河电气工业株式会社 | 2018-11-09 | — | — | CN | disclosed |
| CN-107851627-A | Electronic device package, method for manufacturing electronic device package, and tape for electronic device package | 古河电气工业株式会社 | 2018-03-27 | — | — | CN | disclosed |
| CN-107614641-A | Semiconductor machining band | 古河电气工业株式会社 | 2018-01-19 | — | — | CN | disclosed |
| CN-107431007-A | The back side grinding surface protection tape of semiconductor wafer and the grinding processing method of semiconductor wafer | 古河电气工业株式会社 | 2017-12-01 | — | — | CN | disclosed |
| CN-105899630-A | Film-like adhesive, dicing tape with film-like adhesive, method for manufacturing semiconductor device, and semiconductor device | 日东电工株式会社 | 2016-08-24 | — | — | CN | disclosed |
| CN-105899629-A | Film-like adhesive, dicing tape with film-like adhesive, method for manufacturing semiconductor device, and semiconductor device | 日东电工株式会社 | 2016-08-24 | — | — | CN | disclosed |
| CN-104130726-B | The cut-out processing method of release adhesive compositions, bonding sheet and electronic unit again | 日东电工株式会社 | 2016-08-17 | — | — | CN | disclosed |