SCHEMBL28857220

SCHEMBL28857220

Oc1cc(C2=CC3=CC4=NC(=CC5=NC(=CC6=NC(=CC2=N3)C=C6)C=C5)C=C4)c(O)c(O)c1O.[Ag]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2378803 0.97 — —
SCHEMBL28851704 0.73 — —
SCHEMBL28670275 0.72 CRHBP (0.32) —
SCHEMBL28874540 0.72 ABL1 (0.38) —
SCHEMBL29209970 0.71 — —
SCHEMBL28433792 0.70 AHR (0.31) —
SCHEMBL28985236 0.70 — —
SCHEMBL28363483 0.70 — —
SCHEMBL28492097 0.69 PTPN11 (0.41) —
SCHEMBL29259188 0.69 — —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115157811-A Irradiation-resistant hot melt adhesive double-layer heat-shrinkable sleeve for high-temperature vacuum and preparation method thereof 大连联合高分子材料有限公司 2022-10-11 — — CN claimed
CN-115157811-A Irradiation-resistant hot melt adhesive double-layer heat-shrinkable sleeve for high-temperature vacuum and preparation method thereof 大连联合高分子材料有限公司 2022-10-11 — — CN disclosed
CN-115157811-A Irradiation-resistant hot melt adhesive double-layer heat-shrinkable sleeve for high-temperature vacuum and preparation method thereof 大连联合高分子材料有限公司 2022-10-11 — — CN disclosed
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