Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TRPM8 | Q7Z2W7 | 6/20 | 0.38 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5485158 | 0.82 | TRPM8 (0.33) | TRPM8 | |
| SCHEMBL5490876 | 0.79 | TRPM8 (0.35) | TRPM8 | |
| SCHEMBL19245350 | 0.76 | TRPM8 (0.35) | TRPM8 | |
| SCHEMBL485994 | 0.76 | TSHR (0.36) | TRPM8 | |
| SCHEMBL29159413 | 0.75 | CTSA (0.36) | TRPM8 | |
| SCHEMBL777740 | 0.74 | KDM4E (0.32) | TRPM8 | |
| SCHEMBL9256494 | 0.74 | CTSA (0.32) | TRPM8 | |
| SCHEMBL9961553 | 0.74 | — | — | |
| SCHEMBL5486901 | 0.73 | TRPM8 (0.33) | TRPM8 | |
| SCHEMBL5491366 | 0.73 | TRPM8 (0.33) | TRPM8 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118140606-A | Electromagnetic wave shielding film | 拓自达电线株式会社 | 2024-06-04 | — | — | CN | disclosed |
| CN-114013386-B | Stamping, in particular for permanently closing holes | 德莎欧洲股份公司 | 2024-04-16 | — | — | CN | disclosed |
| CN-117769489-A | Die-cut piece, in particular for permanently closing holes | 德莎欧洲股份公司 | 2024-03-26 | — | — | CN | disclosed |
| CN-110982267-B | Thermosetting resin composition, method for producing same, prepreg, laminated board, and printed wiring board | 株式会社力森诺科 | 2024-03-08 | — | — | CN | disclosed |
| CN-116804821-A | Photosensitive resin composition, photo-cured product thereof, and printed wiring board having photo-cured film of photosensitive resin composition | 株式会社田村制作所 | 2023-09-26 | — | — | CN | disclosed |
| CN-115996999-A | Adhesive composition | 信越聚合物株式会社 | 2023-04-21 | — | — | CN | disclosed |
| CN-115477842-A | Polyamide composition | 朗盛性能材料有限责任公司 | 2022-12-16 | — | — | CN | disclosed |
| CN-110511566-B | Thermosetting resin composition, method for producing same, prepreg, laminate, and printed wiring board | 昭和电工材料株式会社 | 2022-06-03 | — | — | CN | disclosed |
| CN-114381214-A | Die-cut part, in particular for permanently closing a hole | 德莎欧洲股份公司 | 2022-04-22 | — | — | CN | disclosed |
| CN-109415613-B | Adhesive composition, coverlay film using same, flexible copper-clad laminate, and adhesive sheet | 东亚合成株式会社 | 2022-02-11 | — | — | CN | disclosed |
| CN-114013386-A | Stamping part, in particular for permanently closed holes | 德莎欧洲股份公司 | 2022-02-08 | — | — | CN | disclosed |
| CN-107531984-B | Epoxy resin composition, prepreg, carbon fiber-reinforced composite material, and methods for producing these | 帝人株式会社 | 2020-08-25 | — | — | CN | disclosed |
| CN-110982267-A | Thermosetting resin composition, method for producing same, prepreg, laminate, and printed wiring board | 日立化成株式会社 | 2020-04-10 | — | — | CN | disclosed |
| CN-109071778-B | Thermosetting resin composition, method for producing same, prepreg, laminate, and printed wiring board | HITACHI CHEMICAL CO.,LTD. (JP) | 2019-12-10 | — | — | CN | disclosed |