SCHEMBL28894349

SCHEMBL28894349

CCc1ccc2cc3ccccc3c(OC(=O)C3CC=C(C)CC3C(=O)O)c2c1

nearest known ligand 0.39

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
▸ POLB P06746 4/20 0.39
▸ CASP6 P55212 2/20 0.39
▸ CTDSP1 Q9GZU7 2/20 0.39
▸ GRK2 P25098 1/20 0.39
▸ CA1 P00915 1/20 0.37
▸ CA2 P00918 1/20 0.37
▸ TDP1 Q9NUW8 2/20 0.34
▸ KDM4E B2RXH2 3/20 0.34
▸ NPSR1 Q6W5P4 2/20 0.34
▸ MAPT P10636 1/20 0.34
▸ RECQL P46063 1/20 0.34
▸ RAB9A P51151 1/20 0.34
▸ CYP1A2 P05177 1/20 0.34
▸ CYP2A6 P11509 1/20 0.34
▸ CNR2 P34972 3/20 0.33
▸ L3MBTL1 Q9Y468 2/20 0.32
▸ NPC1 O15118 1/20 0.32
▸ TP53 P04637 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28895043 0.94 POLB (0.39) POLBCASP6CTDSP1GRK2CA1
SCHEMBL29963408 0.94 POLB (0.39) POLBCASP6CTDSP1GRK2CA1
SCHEMBL28894505 0.93 POLB (0.39) POLBCASP6CTDSP1GRK2CA1
SCHEMBL28959714 0.90 POLB (0.41) POLBCASP6CTDSP1GRK2CA1
SCHEMBL30945758 0.90 POLB (0.41) POLBCASP6CTDSP1GRK2CA1
SCHEMBL28894971 0.88 CA1 (0.39) POLBCASP6CTDSP1GRK2CA1
SCHEMBL28894692 0.87 ALDH1A1 (0.43) POLBTDP1KDM4ENPSR1MAPT
SCHEMBL28894885 0.87 POLB (0.43) POLBCASP6CTDSP1GRK2CA1
SCHEMBL28894559 0.85 CA1 (0.38) POLBCASP6CTDSP1GRK2CA1
SCHEMBL28894810 0.84 TDP1 (0.34) POLBCASP6CTDSP1GRK2CA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115380075-B Epoxy resin composition for sealing semiconductor 纳美仕有限公司 2024-06-18 — — CN disclosed
CN-115380075-A Epoxy resin composition for semiconductor encapsulation 纳美仕有限公司 2022-11-22 — — CN disclosed
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