SCHEMBL28897340

SCHEMBL28897340

CCO[Si](CCCNCCNC)(OCC)OCC.CNCCNCCC[Si](OC)(OC)OC

nearest known ligand 0.32

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
LMNA P02545 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11311739 0.93 CYP2C19 (0.31)
SCHEMBL2257008 0.91 LMNA (0.36) LMNA
SCHEMBL3623988 0.91 LMNA (0.36) LMNA
SCHEMBL2407427 0.89 LMNA (0.33) LMNA
SCHEMBL24178934 0.87 LMNA (0.32) LMNA
SCHEMBL5960593 0.86 CA12 (0.38) LMNA
SCHEMBL16597992 0.86 LMNA (0.37) LMNA
SCHEMBL3839286 0.86 LMNA (0.37) LMNA
SCHEMBL729887 0.85 CYP2C19 (0.33) LMNA
SCHEMBL15327667 0.85 CYP2C19 (0.33) LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111386594-A Temporary protective film for semiconductor encapsulation molding, lead frame with temporary protective film, molded encapsulation with temporary protective film, and method for manufacturing semiconductor device 日立化成株式会社 2020-07-07 CN disclosed