⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL20239030 | 0.74 | — | — | |
| SCHEMBL29249251 | 0.67 | — | — | |
| SCHEMBL28806323 | 0.60 | — | — | |
| SCHEMBL20239046 | 0.59 | — | — | |
| SCHEMBL8210519 | 0.53 | — | — | |
| SCHEMBL5321376 | 0.53 | — | — | |
| SCHEMBL8711118 | 0.53 | — | — | |
| SCHEMBL28364995 | 0.52 | GRM4 (0.30) | — | |
| SCHEMBL10621926 | 0.52 | — | — | |
| SCHEMBL20239053 | 0.52 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-113527101-B | Novel compound, polymer, process for producing the same, photosensitive resin composition, pattern forming process, cured film, and electronic component | 信越化学工业株式会社 | 2024-04-23 | — | — | CN | disclosed |
| CN-111830785-B | Resin composition, pattern forming method, cured film forming method, interlayer insulating film, surface protecting film, and electronic component | 信越化学工业株式会社 | 2023-08-22 | — | — | CN | disclosed |
| CN-113527680-B | Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component | 信越化学工业株式会社 | 2023-04-28 | — | — | CN | disclosed |