⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8711118 | 0.82 | — | — | |
| SCHEMBL28566397 | 0.80 | CYP11B1 (0.30) | — | |
| SCHEMBL9793648 | 0.69 | — | — | |
| SCHEMBL20239030 | 0.68 | — | — | |
| SCHEMBL5453204 | 0.67 | — | — | |
| SCHEMBL28989463 | 0.67 | — | — | |
| SCHEMBL20239046 | 0.67 | — | — | |
| SCHEMBL22041679 | 0.67 | CYP11B1 (0.32) | — | |
| SCHEMBL4605224 | 0.66 | — | — | |
| SCHEMBL29695880 | 0.66 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119439625-A | Negative photosensitive resin composition, pattern forming method, cured coating film forming method, interlayer insulating film, surface protective film, and electronic component | 信越化学工业株式会社 | 2025-02-14 | — | — | CN | disclosed |
| CN-115044040-B | Polyimide-containing polymer, positive photosensitive resin composition, negative photosensitive resin composition, and pattern forming method | 信越化学工业株式会社 | 2024-07-02 | — | — | CN | disclosed |
| CN-116991034-A | Negative photosensitive resin composition, pattern forming method, interlayer insulating film, surface protective film, and electronic component | 信越化学工业株式会社 | 2023-11-03 | — | — | CN | disclosed |