SCHEMBL2901529

SCHEMBL2901529

CCCCCCCCC=CCCCCCCCCOCCCCCCCCCCCCCCCC

nearest known ligand 0.79

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
LPAR1 Q92633 1/20 0.57
LPAR2 Q9HBW0 1/20 0.57
LPAR3 Q9UBY5 1/20 0.57
FAAH O00519 2/20 0.56
TRPV1 Q8NER1 1/20 0.56
MEN1 O00255 1/20 0.54
THRB P10828 1/20 0.54
HTT P42858 1/20 0.54
KMT2A Q03164 1/20 0.54
MAPT P10636 1/20 0.54

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL755636 1.00 LPAR1 (0.57) LPAR1LPAR2LPAR3FAAHTRPV1
SCHEMBL9751433 1.00 LPAR1 (0.57) LPAR1LPAR2LPAR3FAAHTRPV1
SCHEMBL44028 1.00 LPAR1 (0.57) LPAR1LPAR2LPAR3FAAHTRPV1
SCHEMBL5364867 1.00 LPAR1 (0.57) LPAR1LPAR2LPAR3FAAHTRPV1
SCHEMBL1070643 1.00 LPAR1 (0.57) LPAR1LPAR2LPAR3FAAHTRPV1
SCHEMBL24398977 1.00 LPAR1 (0.57) LPAR1LPAR2LPAR3FAAHTRPV1
SCHEMBL11576564 1.00 LPAR1 (0.57) LPAR1LPAR2LPAR3FAAHTRPV1
SCHEMBL21924992 1.00 LPAR1 (0.57) LPAR1LPAR2LPAR3FAAHTRPV1
SCHEMBL20774497 1.00 LPAR1 (0.57) LPAR1LPAR2LPAR3FAAHTRPV1
SCHEMBL4448701 1.00 LPAR1 (0.57) LPAR1LPAR2LPAR3FAAHTRPV1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240018286-A1 FINE RESIN PARTICLE AND APPLICATION THEREOF SEKISUI KASEI CO., LTD. (JP) 2024-01-18 US disclosed
EP-4265658-A1 RESIN FINE PARTICLES AND APPLICATION THEREOF Sekisui Kasei Co., Ltd. (JP) 2023-10-25 EP disclosed
CN-115836052-A Topical formulations of (1S) -1-phenyl-2-pyridin-2-ylethylamine 拜尔哈文制药股份有限公司 2023-03-21 CN disclosed
EP-3443951-B1 SUPERFATTING AGENT AND PERSONAL CARE COMPOSITION SABO SPA (IT) 2022-09-21 EP disclosed
EP-3613720-B1 WATER ABSORPTION PREVENTING MATERIAL FOR INORGANIC POROUS MATERIAL, METHOD FOR MODIFYING CONCRETE, AND CONCRETE DOW TORAY CO LTD (JP) 2022-08-03 EP disclosed
WO-2022131052-A1 RESIN FINE PARTICLES AND APPLICATION THEREOF 積水化成品工業株式会社 2022-06-23 WO disclosed
US-11351110-B2 Silicone-free cosmetic compositions Thomas, Kirsten Elizabeth (US) 2022-06-07 US disclosed
US-20220125935-A1 COMPOSITION FOR PREVENTING OR TREATING ATOPIC DERMATITIS COMPRISING SKIN-PENETRATING NUCLEIC ACID COMPLEX AS EFFECTIVE COMPONENT SEASUN THERAPEUTICS (KR) 2022-04-28 US disclosed
US-9777251-B2 Liquid composition for removing titanium nitride, semiconductor-element cleaning method using same, and semiconductor-element manufacturing method MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2017-10-03 US disclosed
US-20160281038-A1 LIQUID COMPOSITION FOR REMOVING TITANIUM NITRIDE, SEMICONDUCTOR-ELEMENT CLEANING METHOD USING SAME, AND SEMICONDUCTOR-ELEMENT MANUFACTURING METHOD MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2016-09-29 US disclosed
EP-1342777-B9 Substrate cleaning liquid media and cleaning method MITSUBISHI CHEM CORP (JP) 2010-02-17 EP disclosed
EP-1342777-B1 Substrate cleaning liquid media and cleaning method MITSUBISHI CHEM CORP (JP) 2009-08-19 EP disclosed
EP-1811949-A1 TOPICAL SLIMMING PREPARATION AND A COSMETIC CONTAINING A CARNITINE DERIVATIVE SHOWA DENKO KABUSHIKI KAISHA (JP) 2007-08-01 EP disclosed
US-7235516-B2 For use in semiconductor devices, display devices; for efficiently removing contaminant particles (fine particles) present on a substrate MITSUBISHI CHEMICAL CORPORATION (JP) 2007-06-26 US disclosed
US-20070135322-A1 SUBSTRATE SURFACE CLEANING LIQUID MEDIUM AND CLEANING METHOD MITSUBISHI CHEMICAL CORPORATION (JP) 2007-06-14 US disclosed
WO-2005115326-A1 TOPICAL SLIMMING PREPARATION AND A COSMETIC CONTAINING A CARNITINE DERIVATIVE SHOWA DENKO K.K. (JP) 2005-12-08 WO disclosed
EP-1342777-A1 Substrate cleaning liquid media and cleaning method MITSUBISHI CHEMICAL CORPORATION (JP) 2003-09-10 EP disclosed
US-20030144163-A1 Substrate surface cleaning liquid mediums and cleaning method MITSUBISHI CHEMICAL CORPORATION (JP) 2003-07-31 US disclosed
US-4485091-A HYDROGEN PEROXIDE, OIL IN WATER EMULSION QUINODERM LIMITED (GB) 1984-11-27 US disclosed