SCHEMBL29033902

SCHEMBL29033902

CC(Cc1cccc(CC(C)c2ccc(C#N)cc2)c1)c1ccc(C#N)cc1

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP19A1 P11511 2/20 0.45
GLA P06280 1/20 0.43
GRIA1 P42261 1/20 0.42
GRIA2 P42262 1/20 0.42
GRIA3 P42263 1/20 0.42
GRIA4 P48058 1/20 0.42
ESR1 P03372 1/20 0.42
ESR2 Q92731 1/20 0.42
LOXL2 Q9Y4K0 2/20 0.41
CYP2A6 P11509 2/20 0.41
SLC6A2 P23975 1/20 0.39
SLC6A4 P31645 1/20 0.39
MAOB P27338 3/20 0.39
MAOA P21397 2/20 0.38
HRH3 Q9Y5N1 1/20 0.38
FOLH1 Q04609 1/20 0.37
ALDH1A1 P00352 1/20 0.36
ALOX5AP P20292 1/20 0.36
L3MBTL1 Q9Y468 1/20 0.36
MEN1 O00255 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28848265 0.88 MAOB (0.47) CYP19A1GRIA1GRIA2GRIA3GRIA4
SCHEMBL29244942 0.85 ESR1 (0.57) CYP19A1GRIA1GRIA2GRIA3GRIA4
SCHEMBL13558237 0.85 ESR1 (0.57) CYP19A1GRIA1GRIA2GRIA3GRIA4
SCHEMBL3172156 0.83 HTR2A (0.51) ESR1ESR2CYP2A6SLC6A4HRH3
Ammonia Solution, Strong SCHEMBL5301009 0.82 SLC6A2 (0.54) GLASLC6A2SLC6A4MAOBMAOA
SCHEMBL29065584 0.81 ESR1 (0.47) ESR1ESR2LOXL2CYP2A6MAOB
SCHEMBL2868448 0.79 ESR1 (0.39) ESR1ESR2MEN1KMT2APNMT
SCHEMBL19120694 0.79 GRIA1 (0.40) CYP19A1GLAGRIA1GRIA2GRIA3
SCHEMBL22844050 0.79 ESR1 (0.39) CYP19A1GRIA1GRIA2GRIA3GRIA4
SCHEMBL3684825 0.77 TAAR1 (0.50) ESR1ESR2CYP2A6SLC6A2SLC6A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118251445-A Cyclic organosiloxane containing imide bond and polymerizable unsaturated bond and curable resin composition containing the same 信越化学工业株式会社 2024-06-25 CN disclosed
CN-112204076-B Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board 三菱瓦斯化学株式会社 2023-10-24 CN disclosed
CN-116813824-A Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 三菱瓦斯化学株式会社 2023-09-29 CN disclosed
CN-113646393-B Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 三菱瓦斯化学株式会社 2023-09-19 CN disclosed
CN-116490350-A Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed wiring board 三菱瓦斯化学株式会社 2023-07-25 CN disclosed
CN-113348079-B Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 三菱瓦斯化学株式会社 2023-06-02 CN disclosed
CN-115216150-A Thermally conductive pre-applied underfill formulations and uses thereof 汉高知识产权控股有限责任公司 2022-10-21 CN disclosed