SCHEMBL29045385

SCHEMBL29045385

CCCCc1ccc(OP(=O)(O)O)c(C)c1C

nearest known ligand 0.46

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
INPPL1 O15357 10/20 0.46
INPP5A Q14642 5/20 0.46
AKT1 P31749 1/20 0.46
INPP5B P32019 2/20 0.41
HTR2A P28223 1/20 0.39
HTR2C P28335 1/20 0.39
HTR2B P41595 1/20 0.39
TYR P14679 2/20 0.37
BLM P54132 1/20 0.35
CTRC Q99895 1/20 0.34
ENPP2 Q13822 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29174980 0.94 TYR (0.45) INPPL1INPP5AAKT1INPP5BHTR2A
SCHEMBL29045393 0.94 TYR (0.45) INPPL1INPP5AAKT1INPP5BHTR2A
SCHEMBL1726003 0.89 INPPL1 (0.41) INPPL1INPP5AAKT1INPP5BHTR2A
SCHEMBL381664 0.84 INPPL1 (0.42) INPPL1INPP5AAKT1INPP5BHTR2A
SCHEMBL31296012 0.84 INPPL1 (0.42) INPPL1INPP5AAKT1INPP5BHTR2A
SCHEMBL9760123 0.84 TYR (0.44) INPPL1INPP5AAKT1HTR2AHTR2C
SCHEMBL3233552 0.81 INPPL1 (0.39) INPPL1INPP5AAKT1INPP5BHTR2A
SCHEMBL32660808 0.81 INPPL1 (0.39) INPPL1INPP5AAKT1INPP5BHTR2A
SCHEMBL9706869 0.80 SRC (0.37) INPPL1INPP5AAKT1INPP5BHTR2A
SCHEMBL11128600 0.79 TYR (0.42) INPPL1INPP5AAKT1HTR2AHTR2C

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116323764-A Composition for three-dimensional modeling and three-dimensional modeling object 大金工业株式会社 2023-06-23 CN disclosed
CN-116323817-A Powder composition, coating film and three-dimensional molded article 大金工业株式会社 2023-06-23 CN disclosed
CN-116157461-A Composition for foam molding, foam molded body, electric wire, method for producing foam molded body, and method for producing electric wire 大金工业株式会社 2023-05-23 CN disclosed
CN-116157462-A Composition for foam molding, foam molded body, electric wire, method for producing foam molded body, and method for producing electric wire 大金工业株式会社 2023-05-23 CN disclosed