SCHEMBL2905142

SCHEMBL2905142

CCCC(Oc1ccc(-c2ccc(Oc3cccc(Oc4ccc(-c5ccc(OC(CCC)C6CO6)cc5)cc4)n3)cc2)cc1)C1CO1

nearest known ligand 0.33

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
GHSR Q92847 2/20 0.33
F2 P00734 2/20 0.33
F10 P00742 2/20 0.33
PRSS1 P07477 1/20 0.33
PRSS2 P07478 1/20 0.33
PRSS3 P35030 1/20 0.33
ST14 Q9Y5Y6 1/20 0.33
CYP1A2 P05177 1/20 0.32
CYP2C9 P11712 1/20 0.32
TSHR P16473 1/20 0.32
CYP2C19 P33261 1/20 0.32
HTT P42858 1/20 0.32
HSD17B10 Q99714 1/20 0.32
ADAMTS4 O75173 1/20 0.31
PPARG P37231 2/20 0.30
PPARA Q07869 2/20 0.30
MCL1 Q07820 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2719722 0.74 MAPT (0.35) CYP1A2CYP2C9TSHRCYP2C19HSD17B10
SCHEMBL2836770 0.74 MAPT (0.35) CYP1A2CYP2C9TSHRCYP2C19HSD17B10
SCHEMBL11967022 0.70 LMNA (0.46) PPARGPPARA
SCHEMBL2898835 0.70 TDP1 (0.58) F2F10PRSS1PRSS2PRSS3
SCHEMBL2906566 0.70 TDP1 (0.58) F2F10PRSS1PRSS2PRSS3
SCHEMBL5686879 0.69 TDP1 (0.35) F2F10PRSS1PRSS2PRSS3
SCHEMBL6021886 0.68 TDP1 (0.42) TSHR
SCHEMBL8718740 0.67 NPC1 (0.47) CYP1A2CYP2C9CYP2C19HSD17B10
SCHEMBL2905143 0.66 HDAC3 (0.39) PPARGPPARA
SCHEMBL28675474 0.66 TDP1 (0.40) TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1636209-B1 EPOXY COMPOUND AND CURED EPOXY RESIN PRODUCT SUMITOMO CHEMICAL CO (JP) 2010-08-11 EP disclosed
US-7279574-B2 Epoxy compound and cured epoxy resin product SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2007-10-09 US disclosed
US-20060159929-A1 Epoxy compound and cured epoxy resin product HITACHI, LTD. (JP) 2006-07-20 US disclosed