SCHEMBL29052904

SCHEMBL29052904

[Cu+2].[O-]C(=S)c1nccs1.[O-]C(=S)c1nccs1

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 4/20 0.48
HSD17B10 Q99714 2/20 0.37
TSHR P16473 1/20 0.37
NOS1 P29475 1/20 0.37
HKDC1 Q2TB90 1/20 0.35
FBP1 P09467 1/20 0.34
PDK1 Q15118 1/20 0.34
NPC1 O15118 2/20 0.33
GAA P10253 2/20 0.33
NFKB1 P19838 2/20 0.33
HTT P42858 2/20 0.33
RAB9A P51151 2/20 0.33
SMN1; SMN2 Q16637 2/20 0.33
CYP1A2 P05177 2/20 0.33
CYP2D6 P10635 2/20 0.33
CYP2C19 P33261 2/20 0.33
PLA2G4A P47712 1/20 0.33
MEN1 O00255 1/20 0.33
LMNA P02545 1/20 0.33
CYP3A4 P08684 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27838341 0.78 ALDH1A1 (0.54) ALDH1A1HSD17B10TSHRNOS1HKDC1
SCHEMBL11840873 0.76
SCHEMBL21706524 0.74
SCHEMBL11115668 0.74
Potassium Ion SCHEMBL29528968 0.73
Zinc Ion SCHEMBL30497943 0.73 ALDH1A1 (0.59) ALDH1A1HSD17B10TSHRNOS1FBP1
Lithium Ion SCHEMBL5484932 0.73
Water SCHEMBL15012696 0.71 ALDH1A1 (0.57) ALDH1A1HSD17B10TSHRNOS1CYP1A2
SCHEMBL4768668 0.70 ALDH1A1 (0.56) ALDH1A1HSD17B10TSHRNOS1FBP1
SCHEMBL5179242 0.70

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119900058-A Copper plating solution, metal copper layer comprising copper plating solution and application of copper plating solution 江阴纳力新材料科技有限公司 2025-04-29 CN claimed
CN-116607183-B Automatic control method and device for electrolytic copper foil 湖南龙智新材料科技有限公司 2023-11-24 CN claimed
CN-116607183-A Automatic control method and device for electrolytic copper foil 湖南龙智新材料科技有限公司 2023-08-18 CN claimed
CN-119900058-A Copper plating solution, metal copper layer comprising copper plating solution and application of copper plating solution 江阴纳力新材料科技有限公司 2025-04-29 CN disclosed