SCHEMBL2906351

SCHEMBL2906351

Oc1ccc(Oc2cncc(Oc3ccc(O)cc3)c2)cc1

nearest known ligand 0.64

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 1/20 0.64
KMT2A Q03164 1/20 0.64
ESR1 P03372 1/20 0.64
ESR2 Q92731 1/20 0.64
LTA4H P09960 6/20 0.54
NR1H2 P55055 1/20 0.54
BAX Q07812 1/20 0.54
MAPK1 P28482 1/20 0.46
PARP10 Q53GL7 1/20 0.45
LMNA P02545 1/20 0.42
TDP1 Q9NUW8 1/20 0.42
XDH P47989 2/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2905032 0.94 ESR2 (0.56) MEN1KMT2AESR1ESR2LTA4H
SCHEMBL5632639 0.84 SIRT2 (0.50) MEN1KMT2AESR1ESR2LTA4H
SCHEMBL16551547 0.83 MEN1 (0.82) MEN1KMT2AESR1ESR2LTA4H
SCHEMBL166230 0.82 MEN1 (0.64) MEN1KMT2AESR1ESR2LTA4H
SCHEMBL249169 0.80 ESR2 (1.00) MEN1KMT2AESR1ESR2LTA4H
SCHEMBL3175106 0.80 ESR2 (1.00) MEN1KMT2AESR1ESR2LTA4H
SCHEMBL18198 0.80 ESR2 (1.00) MEN1KMT2AESR1ESR2LTA4H
SCHEMBL7811939 0.80 ESR2 (1.00) MEN1KMT2AESR1ESR2LTA4H
Hydrogen Sulfide SCHEMBL27529439 0.77 MEN1 (0.93) MEN1KMT2AESR1ESR2LTA4H
Water SCHEMBL8862151 0.77 MEN1 (0.93) MEN1KMT2AESR1ESR2LTA4H

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1636209-B1 EPOXY COMPOUND AND CURED EPOXY RESIN PRODUCT SUMITOMO CHEMICAL CO (JP) 2010-08-11 EP disclosed
US-7279574-B2 Epoxy compound and cured epoxy resin product SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2007-10-09 US disclosed
US-20060159929-A1 Epoxy compound and cured epoxy resin product HITACHI, LTD. (JP) 2006-07-20 US disclosed