Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.44 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.40 |
| ▸ | TP53 | P04637 | 4/20 | 0.40 |
| ▸ | TSHR | P16473 | 4/20 | 0.40 |
| ▸ | SMN1; SMN2 | Q16637 | 3/20 | 0.40 |
| ▸ | HIF1A | Q16665 | 2/20 | 0.40 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.40 |
| ▸ | MEN1 | O00255 | 2/20 | 0.39 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.39 |
| ▸ | MAPT | P10636 | 3/20 | 0.37 |
| ▸ | HPGD | P15428 | 2/20 | 0.37 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.37 |
| ▸ | PPARG | P37231 | 1/20 | 0.37 |
| ▸ | LMNA | P02545 | 1/20 | 0.37 |
| ▸ | GAA | P10253 | 1/20 | 0.37 |
| ▸ | PKM | P14618 | 1/20 | 0.37 |
| ▸ | LTA4H | P09960 | 4/20 | 0.36 |
| ▸ | F2 | P00734 | 1/20 | 0.35 |
| ▸ | F10 | P00742 | 1/20 | 0.35 |
| ▸ | PRSS1 | P07477 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2906566 | 0.88 | TDP1 (0.58) | TDP1ALDH1A1TP53TSHRSMN1; SMN2 | |
| SCHEMBL2898835 | 0.88 | TDP1 (0.58) | TDP1ALDH1A1TP53TSHRSMN1; SMN2 | |
| SCHEMBL28371423 | 0.85 | TDP1 (0.57) | TDP1ALDH1A1TP53TSHRSMN1; SMN2 | |
| SCHEMBL2829822 | 0.85 | TDP1 (0.50) | TDP1ALDH1A1TP53TSHRSMN1; SMN2 | |
| SCHEMBL2719932 | 0.85 | TDP1 (0.50) | TDP1ALDH1A1TP53TSHRSMN1; SMN2 | |
| SCHEMBL2898456 | 0.83 | TDP1 (0.64) | TDP1ALDH1A1TP53TSHRSMN1; SMN2 | |
| SCHEMBL2905143 | 0.83 | HDAC3 (0.39) | TDP1MEN1KMT2APPARGLTA4H | |
| SCHEMBL2902681 | 0.83 | TDP1 (0.40) | TDP1ALDH1A1TP53TSHRSMN1; SMN2 | |
| SCHEMBL2905896 | 0.82 | ALDH1A1 (0.54) | TDP1ALDH1A1TP53TSHRSMN1; SMN2 | |
| SCHEMBL9325190 | 0.80 | TDP1 (0.55) | TDP1ALDH1A1TP53TSHRSMN1; SMN2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2692526-B1 | MULTILAYER RESIN SHEET, RESIN SHEET LAMINATE, CURED MULTILAYER RESIN SHEET AND METHOD FOR PRODUCING SAME, MULTILAYER RESIN SHEET WITH METAL FOIL, AND SEMICONDUCTOR DEVICE | HITACHI CHEMICAL CO LTD (JP) | 2020-10-28 | — | — | EP | disclosed |
| EP-2692759-B1 | RESIN COMPOSITION, RESIN SHEET, CURED RESIN SHEET, RESIN SHEET LAMINATE, CURED RESIN SHEET LAMINATE AND METHOD FOR MANUFACTURING SAME, SEMICONDUCTOR DEVICE, AND LED DEVICE | HITACHI CHEMICAL CO LTD (JP) | 2018-10-31 | — | — | EP | disclosed |
| EP-3015487-B1 | RESIN COMPOSITION, RESIN SHEET, CURED RESIN SHEET, RESIN SHEET STRUCTURE, CURED RESIN SHEET STRUCTURE, METHOD FOR PRODUCING CURED RESIN SHEET STRUCTURE, SEMICONDUCTOR DEVICE, AND LED DEVICE | HITACHI CHEMICAL CO LTD (JP) | 2018-04-04 | — | — | EP | disclosed |
| US-20180009979-A1 | RESIN COMPOSITION, RESIN SHEET, AND CURED RESIN MATERIAL AND METHOD FOR PRODUCING THE SAME | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2018-01-11 | — | — | US | disclosed |
| US-9745411-B2 | Resin composition, resin sheet, cured resin sheet, resin sheet structure, cured resin sheet structure, method for producing cured resin sheet structure, semiconductor device, and LED device | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2017-08-29 | — | — | US | disclosed |
| US-20160177024-A1 | RESIN COMPOSITION, RESIN SHEET, CURED RESIN SHEET, RESIN SHEET STRUCTURE, CURED RESIN SHEET STRUCTURE, METHOD FOR PRODUCING CURED RESIN SHEET STRUCTURE, SEMICONDUCTOR DEVICE, AND LED DEVICE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2016-06-23 | — | — | US | disclosed |
| US-9349931-B2 | Resin composition, resin sheet, cured resin sheet, resin sheet laminate, cured resin sheet laminate and method for producing same, semiconductor device and LED device | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2016-05-24 | — | — | US | disclosed |
| EP-3015487-A1 | RESIN COMPOSITION, RESIN SHEET, CURED RESIN SHEET, RESIN SHEET STRUCTURE, CURED RESIN SHEET STRUCTURE, METHOD FOR PRODUCING CURED RESIN SHEET STRUCTURE, SEMICONDUCTOR DEVICE, AND LED DEVICE | Hitachi Chemical Co., Ltd. (JP) | 2016-05-04 | — | — | EP | disclosed |
| US-20140283972-A1 | RESIN COMPOSITION, RESIN SHEET, AND CURED RESIN MATERIAL AND METHOD FOR PRODUCING THE SAME | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2014-09-25 | — | — | US | disclosed |
| US-20140079913-A1 | MULTILAYER RESIN SHEET, RESIN SHEET LAMINATE, CURED MULTILAYER RESIN SHEET AND METHOD FOR PRODUCING SAME, MULTILAYER RESIN SHEET WITH METAL FOIL, AND SEMICONDUCTOR DEVICE | HITACHI CHEMICAL CO.,LTD (JP) | 2014-03-20 | — | — | US | disclosed |
| EP-2626205-A1 | MULTILAYER RESIN SHEET AND PROCESS FOR PRODUCTION THEREOF, RESIN SHEET LAMINATE AND PROCESS FOR PRODUCTION THEREOF, CURED MULTILAYER RESIN SHEET, METAL-FOIL-CLADDED MULTILAYER RESIN SHEET, AND SEMICONDUCTOR DEVICE | Hitachi Chemical Co., Ltd. (JP) | 2013-08-14 | — | — | EP | disclosed |
| US-20130189514-A1 | MULTILAYER RESIN SHEET AND PROCESS FOR PRODUCTION THEREOF, RESIN SHEET LAMINATE AND PROCESS FOR PRODUCTION THEREOF, CURED MULTILAYER RESIN SHEET, METAL-FOIL-CLADDED MULTILAYER RESIN SHEET, AND SEMICONDUCTOR DEVICE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2013-07-25 | — | — | US | disclosed |
| US-20120251830-A1 | RESIN COMPOSITION, RESIN SHEET, AND CURED RESIN MATERIAL AND METHOD FOR PRODUCING THE SAME | HITACHI CHEMICAL COMPANY, LTD (JP) | 2012-10-04 | — | — | US | disclosed |
| US-20120244351-A1 | MULTILAYER RESIN SHEET AND METHOD FOR PRODUCING THE SAME, METHOD FOR PRODUCING CURED MULTILAYER RESIN SHEET, AND HIGHLY THERMALLY CONDUCTIVE RESIN SHEET LAMINATE AND METHOD FOR PRODUCING THE SAME | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-09-27 | — | — | US | disclosed |
| EP-2484724-A1 | MULTILAYER RESIN SHEET AND METHOD FOR PRODUCING SAME, METHOD FOR PRODUCING MULTILAYER RESIN SHEET CURED PRODUCT, AND HIGHLY THERMALLY CONDUCTIVE RESIN SHEET LAMINATE AND METHOD FOR PRODUCING SAME | Hitachi Chemical Company, Ltd. (JP) | 2012-08-08 | — | — | EP | disclosed |
| EP-1636209-B1 | EPOXY COMPOUND AND CURED EPOXY RESIN PRODUCT | SUMITOMO CHEMICAL CO (JP) | 2010-08-11 | — | — | EP | disclosed |
| US-7279574-B2 | Epoxy compound and cured epoxy resin product | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2007-10-09 | — | — | US | disclosed |
| US-20060159929-A1 | Epoxy compound and cured epoxy resin product | HITACHI, LTD. (JP) | 2006-07-20 | — | — | US | disclosed |
| EP-1636209-A1 | EPOXY COMPOUND AND CURED EPOXY RESIN PRODUCT | Sumitomo Chemical Company, Limited (JP) | 2006-03-22 | — | — | EP | disclosed |
| WO-2004113327-A1 | EPOXY COMPOUND AND CURED EPOXY RESIN PRODUCT | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2004-12-29 | — | — | WO | disclosed |