⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Phosphine SCHEMBL17511082 | 0.89 | — | — | |
| Phosphine SCHEMBL29279460 | 0.87 | — | — | |
| Phosphine SCHEMBL4869773 | 0.87 | — | — | |
| Phosphine SCHEMBL595812 | 0.87 | — | — | |
| SCHEMBL5722446 | 0.75 | — | — | |
| SCHEMBL4274624 | 0.75 | — | — | |
| Phosphine SCHEMBL959864 | 0.75 | — | — | |
| SCHEMBL9187969 | 0.75 | — | — | |
| Phosphine SCHEMBL7464507 | 0.75 | — | — | |
| Phosphine SCHEMBL3652784 | 0.75 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 57 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115747560-A | Low-roughness copper-nickel-tin-phosphorus alloy foil and preparation method thereof | 中色奥博特铜铝业有限公司 | 2023-03-07 | — | — | CN | claimed |
| CN-117778799-A | High-temperature softening resistant copper-nickel-tin-phosphorus-copper alloy and preparation process thereof | 中铝洛阳铜加工有限公司 | 2024-03-29 | — | — | CN | disclosed |
| CN-115747560-A | Low-roughness copper-nickel-tin-phosphorus alloy foil and preparation method thereof | 中色奥博特铜铝业有限公司 | 2023-03-07 | — | — | CN | disclosed |
| CN-115747560-A | Low-roughness copper-nickel-tin-phosphorus alloy foil and preparation method thereof | 中色奥博特铜铝业有限公司 | 2023-03-07 | — | — | CN | disclosed |
| CN-115747560-A | Low-roughness copper-nickel-tin-phosphorus alloy foil and preparation method thereof | 中色奥博特铜铝业有限公司 | 2023-03-07 | — | — | CN | disclosed |
| EP-3485047-B1 | COPPER-NICKEL-TIN ALLOY, METHOD FOR THE PRODUCTION AND USE THEREOF | WIELAND WERKE AG (DE) | 2022-08-17 | — | — | EP | disclosed |
| US-11041233-B2 | Copper-nickel-tin alloy, method for the production and use thereof | WIELAND-WERKE AG (DE) | 2021-06-22 | — | — | US | disclosed |
| US-11035024-B2 | Copper-nickel-tin alloy, method for the production thereof and use thereof | WIELAND-WERKE AG (DE) | 2021-06-15 | — | — | US | disclosed |
| US-11035025-B2 | Copper-nickel-tin alloy, method for the production and use thereof | WIELAND-WERKE AG (DE) | 2021-06-15 | — | — | US | disclosed |
| CN-109477167-B | Copper-nickel-tin alloy, method for the production thereof and use thereof | 威兰德-沃克公开股份有限公司 | 2020-12-15 | — | — | CN | disclosed |
| US-20050230454-A1 | Copper-based brazing alloy and brazing process | VACUUMSCHMELZE GMBH & CO. KG | 2005-10-20 | — | — | US | disclosed |
| US-20050184132-A1 | Thermal spray application of brazing material for manufacture of heat transfer devices | LUVATA ESPOO OY (FI) | 2005-08-25 | — | — | US | disclosed |
| WO-2005032751-A1 | THERMAL SPRAY APPLICATION OF BRAZING MATERIAL FOR MANUFACTURE OF HEAT TRANSFER DEVICES | OUTOKUMPU COPPER PRODUCTS OY (FI) | 2005-04-14 | — | — | WO | disclosed |
| US-20050072836-A1 | Thermal spray application of brazing material for manufacture of heat transfer devices | LUVATA ESPOO OY (FI) | 2005-04-07 | — | — | US | disclosed |
| CN-1520343-A | Method of mfg. heat transfer tubes | ���п�ķ�����Ϲɷݹ�˾ | 2004-08-11 | — | — | CN | disclosed |
| US-20040099408-A1 | Interconnected microchannel tube | OUTOKUMPU OYJ (FI) | 2004-05-27 | — | — | US | disclosed |
| EP-1399280-A1 | METHOD OF MANUFACTURING HEAT TRANSFER TUBES | Outokumpu Oyj (FI) | 2004-03-24 | — | — | EP | disclosed |
| US-6530514-B2 | Method of manufacturing heat transfer tubes | OUTOKUMPU OYJ (FI) | 2003-03-11 | — | — | US | disclosed |
| WO-2003002282-A1 | METHOD OF MANUFACTURING HEAT TRANSFER TUBES | OUTOKUMPU OYJ (FI) | 2003-01-09 | — | — | WO | disclosed |
| US-20030001000-A1 | Method of manufacturing heat transfer tubes | OUTOKUMPU OYJ (FI) | 2003-01-02 | — | — | US | disclosed |