⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Phosphine SCHEMBL2907170 | 0.87 | — | — | |
| Phosphine SCHEMBL7464507 | 0.87 | — | — | |
| Phosphine SCHEMBL108726 | 0.82 | — | — | |
| Phosphine SCHEMBL4039979 | 0.82 | — | — | |
| Phosphine SCHEMBL4077669 | 0.82 | — | — | |
| Phosphine SCHEMBL7103999 | 0.82 | — | — | |
| Phosphine SCHEMBL10614756 | 0.78 | — | — | |
| Phosphine SCHEMBL17511082 | 0.78 | — | — | |
| Phosphine SCHEMBL23273822 | 0.67 | — | — | |
| Phosphine SCHEMBL3264789 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-104561960-A | High-stability nickel-tin-phosphorus chemical plating solution | UNIV ZHEJIANG OCEAN | 2015-04-29 | — | — | CN | claimed |
| CN-103484870-A | Surface treatment method for improving corrosion resistance of grounding wires | STATE GRID CORP CHINA | 2014-01-01 | — | — | CN | claimed |
| CN-102400119-B | Chemical nickel plating method on magnesium alloy | UNIV JILIN NORMAL | 2013-06-19 | — | — | CN | claimed |
| CN-114509884-B | Circuit board, preparation method thereof, functional backboard, backlight module and display device | 京东方科技集团股份有限公司 | 2023-11-17 | — | — | CN | disclosed |
| CN-108505024-A | Chemical plating ni-sn-aluminium-phosphorus amorphous state multifunctional alloy plating solution and its coating | 林忠华 | 2018-09-07 | — | — | CN | disclosed |
| CN-106435536-B | For slender rectangular tube inner surface chemical plating and the device and method of Ni-P | 中国科学院金属研究所 | 2018-08-28 | — | — | CN | disclosed |
| CN-206266707-U | For slender rectangular tube inner surface chemical plating and the device of Ni-P | 中国科学院金属研究所 | 2017-06-20 | — | — | CN | disclosed |
| CN-104561960-A | High-stability nickel-tin-phosphorus chemical plating solution | UNIV ZHEJIANG OCEAN | 2015-04-29 | — | — | CN | disclosed |
| CN-103484870-A | Surface treatment method for improving corrosion resistance of grounding wires | STATE GRID CORP CHINA | 2014-01-01 | — | — | CN | disclosed |
| CN-102443791-B | Chemical nickel-tin-phosphor alloy-plating solution for magnesium alloy and treatment process of chemical nickel-tin-phosphor alloy-plating solution | UNIV CHANGAN | 2013-10-23 | — | — | CN | disclosed |
| CN-102400119-B | Chemical nickel plating method on magnesium alloy | UNIV JILIN NORMAL | 2013-06-19 | — | — | CN | disclosed |
| CN-102443791-A | Magnesium alloy chemical nickel-tin-phosphorus alloy plating solution and treatment process thereof | UNIV CHANGAN | 2012-05-09 | — | — | CN | disclosed |
| CN-102400119-A | Chemical nickel plating method on magnesium alloy | UNIV JILIN NORMAL | 2012-04-04 | — | — | CN | disclosed |
| CN-101939460-A | Method for manufacturing precipitation hardening type copper alloy strip | MITSUI MINING & SMELTING CO | 2011-01-05 | — | — | CN | disclosed |
| US-20080078533-A1 | CORROSION RESISTANT, ALLOY-COATED CHARGE AIR COOLER | INTERNATIONAL TRUCK INTELLECTUAL PROPERTY COMPANY, LLC (US) | 2008-04-03 | — | — | US | disclosed |
| EP-1906131-A2 | Corrosion resistant, alloy-coated charge air cooler | International Truck Intellectual Property Company, LLC. (US) | 2008-04-02 | — | — | EP | disclosed |
| US-7156283-B2 | Method for making a solder between metallic balls of an electronic component and mounting lands of a circuit and soldering furnace therefor | L'AIR LIQUIDE, SOCIETE ANONYME A DIRECTOIRE ET CONSEIL DE SURVEILLANCE POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GEORGES CLAUDE (FR) | 2007-01-02 | — | — | US | disclosed |
| US-20040045642-A1 | Method for making a solder between metallic balls of an electronic component and mounting lands of a circuit and soldering furnace therefor | L'AIR LIQUIDE, SOCIETE ANONYME A DIRECTOIRE ET CONSEIL DE SURVEILLANCE POUR L'ETUDE ET, L'EXPLOITATION DES PROCEDES GEORGES, CLAUDE (FR) | 2004-03-11 | — | — | US | disclosed |
| CN-1480015-A | Method for producing a solder joint between a metal ball of an electronic component and a receiving pad of a circuit and soldering furnace for carrying out the method | Һ�����������·������ú��о��ľ� | 2004-03-03 | — | — | CN | disclosed |
| JP-2000017481-A | METHOD FOR ALLOY PLATING EXCELLENT IN CORROSION RESISTANCE AND PLATED PRODUCT | EBARA UDYLITE KK | 2000-01-18 | — | — | JP | disclosed |