SCHEMBL29089261

SCHEMBL29089261

Cc1cc(C)c(C(=O)[PH](C)=O)c(C)c1

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 2/20 0.41
L3MBTL1 Q9Y468 1/20 0.41
TAS1R3 Q7RTX0 3/20 0.38
TAS1R1 Q7RTX1 3/20 0.38
TAS1R2 Q8TE23 3/20 0.38
KMT2A Q03164 3/20 0.37
HPGD P15428 2/20 0.37
MEN1 O00255 1/20 0.37
LMNA P02545 1/20 0.37
SMN1; SMN2 Q16637 1/20 0.37
NPSR1 Q6W5P4 1/20 0.37
MCOLN3 Q8TDD5 1/20 0.37
ALDH1A1 P00352 3/20 0.36
MAPT P10636 1/20 0.35
MAPK1 P28482 1/20 0.35
TPMT P51580 1/20 0.34
HCAR1 Q9BXC0 1/20 0.34
CA1 P00915 1/20 0.33
CA2 P00918 1/20 0.33
MMP1 P03956 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL460621 0.84 TAS1R3 (0.39) KDM4EL3MBTL1TAS1R3TAS1R1TAS1R2
SCHEMBL4244313 0.82 TAS1R3 (0.38) KDM4EL3MBTL1TAS1R3TAS1R1TAS1R2
SCHEMBL22157783 0.82 TAS1R3 (0.38) KDM4EL3MBTL1TAS1R3TAS1R1TAS1R2
Ethane SCHEMBL8533300 0.82 TAS1R3 (0.38) KDM4EL3MBTL1TAS1R3TAS1R1TAS1R2
SCHEMBL22157679 0.82 TAS1R3 (0.38) KDM4EL3MBTL1TAS1R3TAS1R1TAS1R2
SCHEMBL23422046 0.80 TAS1R3 (0.37) KDM4EL3MBTL1TAS1R3TAS1R1TAS1R2
Benzene SCHEMBL28241020 0.80 KDM4E (0.40) KDM4EL3MBTL1TAS1R3TAS1R1TAS1R2
SCHEMBL28385571 0.80 TAS1R3 (0.37) KDM4EL3MBTL1TAS1R3TAS1R1TAS1R2
SCHEMBL28376873 0.80 TAS1R3 (0.37) KDM4EL3MBTL1TAS1R3TAS1R1TAS1R2
Lithium Ion SCHEMBL26620593 0.78 TAS1R3 (0.36) KDM4EL3MBTL1TAS1R3TAS1R1TAS1R2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110447097-B Warp correction material and manufacturing method of fan-out type wafer level package 太阳控股株式会社 2023-09-01 CN disclosed