SCHEMBL2911465

SCHEMBL2911465

Cc1c(N)c(CCO)cc2[nH]nnc12

nearest known ligand 0.31

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
TKT P29401 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5453438 0.86 NOS3 (0.30)
SCHEMBL5465512 0.84 TLR8 (0.33)
SCHEMBL5455695 0.82 TLR8 (0.35)
SCHEMBL5449224 0.81 TLR8 (0.34)
SCHEMBL5447126 0.81 TLR8 (0.34)
SCHEMBL5455650 0.81 TLR8 (0.34)
SCHEMBL5460077 0.81 TLR8 (0.34)
SCHEMBL5459879 0.81 TLR8 (0.34)
SCHEMBL5450965 0.81 TLR8 (0.34)
SCHEMBL27730992 0.81 TLR8 (0.34)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-101255316-A Polishing liquid FUJIFILM CORP (JP) 2008-09-03 CN claimed
CN-106537564-A Seal composition and production method for semiconductor device 三井化学株式会社 2017-03-22 CN disclosed
CN-106488949-A Adhesion promoter, curable silicone composition, and semiconductor device 道康宁东丽株式会社 2017-03-08 CN disclosed
CN-106459102-A Organosiloxane, curable silicone composition, and semiconductor device 道康宁东丽株式会社 2017-02-22 CN disclosed
CN-102206559-B Cleaning composition, cleaning process, and process for producing semiconductor device FUJIFILM CORP 2015-01-28 CN disclosed
CN-101215447-B Composition for polishing FUJIMI INC 2011-09-28 CN disclosed
CN-101177592-B Composition for polishing FUJIMI INC 2011-08-10 CN disclosed
CN-101186784-B Polishing composition FUJIMI INC 2011-04-27 CN disclosed
EP-1092788-B1 Corrosion inhibiting compositions BRAD CHEM TECHNOLOGY LTD (GB) 2010-08-11 EP disclosed
CN-101469252-A Polishing composition FUJIMI INC (JP) 2009-07-01 CN disclosed
CN-101469253-A Grinding composition FUJIMI INC (JP) 2009-07-01 CN disclosed
CN-101333417-A Polishing liquid and polishing method using the same FUJIFILM CORP (JP) 2008-12-31 CN disclosed
CN-101255316-A Polishing liquid FUJIFILM CORP (JP) 2008-09-03 CN disclosed
CN-101215447-A Composition for polishing FUJIMI INC (JP) 2008-07-09 CN disclosed
CN-100393833-C Polishing composition FUJIMI INC (JP) 2008-06-11 CN disclosed
CN-101186784-A Polishing composition FUJIMI INC (JP) 2008-05-28 CN disclosed
CN-101177592-A Composition for polishing FUJIMI INC (JP) 2008-05-14 CN disclosed
US-6984340-B1 Corrosion inhibiting formulations BRAD-CHEM TECHNOLOGY LIMTIED (GB) 2006-01-10 US disclosed
CN-1616575-A Polishing composition FUJIMI INC (JP) 2005-05-18 CN disclosed
EP-1092788-A2 Corrosion inhibiting compositions Brad-Chem Technology Ltd. (GB) 2001-04-18 EP disclosed