SCHEMBL2912853

SCHEMBL2912853

CCC(C)(C)OOC(C)(C)OC(=O)OC(C)(C)OOC(C)(C)CC

nearest known ligand 0.35

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.35
ALDH1A1 P00352 1/20 0.35
TDP1 Q9NUW8 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21433577 0.88 ALDH1A1 (0.30) TSHRALDH1A1TDP1
SCHEMBL2912856 0.84 TSHR (0.33) TSHRALDH1A1TDP1
SCHEMBL21879267 0.80
SCHEMBL475144 0.78 TSHR (0.43) TSHRALDH1A1TDP1
SCHEMBL25540 0.77 TSHR (0.47) TSHRALDH1A1TDP1
SCHEMBL44412 0.75 TSHR (0.44) TSHRALDH1A1TDP1
Acetic Acid SCHEMBL29229984 0.75 TSHR (0.41) TSHRALDH1A1TDP1
Methyl Alcohol SCHEMBL8027284 0.74 TSHR (0.50) TSHRALDH1A1TDP1
SCHEMBL22437 0.74 TSHR (0.56) TSHRALDH1A1TDP1
SCHEMBL22611957 0.73 TSHR (0.39) TSHRALDH1A1TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 87 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3419051-B1 CURABLE RESIN COMPOSITION AND FAN OUT TYPE WAFER LEVEL PACKAGE TAIYO HOLDINGS CO LTD (JP) 2026-04-08 EP disclosed
US-12448470-B2 Polymerizable composition for optical material, molded product, optical material, and plastic lens and method for manufacturing same MITSUI CHEMICALS, INC. (JP) 2025-10-21 US disclosed
EP-4610301-A1 METHOD FOR PRODUCING ALIPHATIC POLYESTER-BASED FOAM PARTICLES Kaneka Corporation (JP) 2025-09-03 EP disclosed
US-20250136741-A1 THERMOSETTING RESIN COMPOSITION, RESIN SHEET, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2025-05-01 US disclosed
WO-2025053037-A1 LAMINATE ジャパンコンポジット株式会社 2025-03-13 WO disclosed
WO-2025041676-A1 SEALING SHEET AND DISPLAY artience株式会社 2025-02-27 WO disclosed
EP-4502026-A1 POLY(3-HYDROXYALKANOATE)-BASED RESIN FOAM PARTICLES Kaneka Corporation (JP) 2025-02-05 EP disclosed
EP-4502027-A1 METHOD FOR PRODUCING ALIPHATIC POLYESTER-BASED FOAM PARTICLES Kaneka Corporation (JP) 2025-02-05 EP disclosed
WO-2025004816-A1 RESIN COMPOSITION FOR PREPREG, PREPREG AND MOLDED ARTICLE DIC株式会社 2025-01-02 WO disclosed
WO-2025004979-A1 UNSATURATED POLYESTER RESIN COMPOSITION, MOLDING MATERIAL, AND MOLDED ARTICLE ジャパンコンポジット株式会社 2025-01-02 WO disclosed
US-20190002659-A1 PREPREG AND MOLDED ARTICLE DIC CORPORATION (JP) 2019-01-03 US disclosed
EP-3419051-A1 CURABLE RESIN COMPOSITION AND FAN OUT TYPE WAFER LEVEL PACKAGE Taiyo Ink Mfg. Co., Ltd. (JP) 2018-12-26 EP disclosed
EP-3395869-A1 PREPREG AND MOLDED ARTICLE DIC Corporation (JP) 2018-10-31 EP disclosed
US-20170203476-A1 THERMOSETTING COMPOSITION, AND METHOD FOR MANUFACTURING THERMOSET RESIN IDEMITSU KOSAN CO., LTD. (JP) 2017-07-20 US disclosed
US-9403925-B2 Curable composition and cured article ADEKA CORPORATION (JP) 2016-08-02 US disclosed
US-20150299550-A1 THERMALLY CONDUCTIVE RESIN COMPOSITION PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2015-10-22 US disclosed
EP-2223802-B1 RESIN FOR FOAMABLE LAYERED PRODUCT, FOAMABLE LAYERED PRODUCT, AND FOAMED CONVERTED PAPER AND HEAT-INSULATING CONTAINER BOTH OBTAINED FROM THE SAME JAPAN POLYETHYLENE CORP (JP) 2015-09-09 EP disclosed
US-20140187715-A1 CURABLE COMPOSITION AND CURED ARTICLE ADEKA CORPORATION (JP) 2014-07-03 US disclosed
EP-2749581-A1 CURABLE COMPOSITION AND CURED ARTICLE Adeka Corporation (JP) 2014-07-02 EP disclosed
EP-2223802-A1 RESIN FOR FOAMABLE LAYERED PRODUCT, FOAMABLE LAYERED PRODUCT, AND FOAMED CONVERTED PAPER AND HEAT-INSULATING CONTAINER BOTH OBTAINED FROM THE SAME Japan Polyethylene Corporation (JP) 2010-09-01 EP disclosed