SCHEMBL29129472

SCHEMBL29129472

CCOCC#CC(O)(O)OCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28040229 0.77
SCHEMBL29981117 0.75 HSD17B10 (0.30)
SCHEMBL19249200 0.70
SCHEMBL6364629 0.69 ALDH1A1 (0.35)
SCHEMBL21081839 0.66
SCHEMBL8001485 0.65 ALDH1A1 (0.32)
SCHEMBL3138781 0.64
SCHEMBL1787121 0.63
SCHEMBL1788888 0.63
SCHEMBL3227729 0.62

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119465317-A Cobalt electroplating additive and use method thereof 湖北工程学院 2025-02-18 CN claimed
CN-115787053-B High-stability electroplating additive and preparation method thereof 南通赛可特电子有限公司 2024-11-12 CN claimed
CN-115787053-A High-stability electroplating additive and preparation method thereof 南通赛可特电子有限公司 2023-03-14 CN claimed
CN-119465317-A Cobalt electroplating additive and use method thereof 湖北工程学院 2025-02-18 CN disclosed
CN-115787053-B High-stability electroplating additive and preparation method thereof 南通赛可特电子有限公司 2024-11-12 CN disclosed
CN-115787053-A High-stability electroplating additive and preparation method thereof 南通赛可特电子有限公司 2023-03-14 CN disclosed