SCHEMBL29133977

SCHEMBL29133977

CCCCCCCCCC(C)c1nccn1C(C)C#N

nearest known ligand 0.33

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
ADA P00813 5/20 0.32
TLR8 Q9NR97 2/20 0.32
GPR84 Q9NQS5 1/20 0.32
PDE2A O00408 2/20 0.30
PDE4A P27815 1/20 0.30
PDE4B Q07343 1/20 0.30
PDE4C Q08493 1/20 0.30
PDE4D Q08499 1/20 0.30
KDM4E B2RXH2 1/20 0.30
ALDH1A1 P00352 1/20 0.30
CYP1A2 P05177 1/20 0.30
CYP3A4 P08684 1/20 0.30
ALOX15 P16050 1/20 0.30
SMN1; SMN2 Q16637 1/20 0.30
HSD17B10 Q99714 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5327498 0.85 TLR8 (0.37) ADATLR8GPR84PDE2APDE4A
SCHEMBL5329922 0.85 TLR8 (0.37) ADATLR8GPR84PDE2APDE4A
SCHEMBL5331765 0.82 ALDH1A1 (0.37) ADATLR8GPR84ALDH1A1SMN1; SMN2
SCHEMBL5332385 0.82 ALDH1A1 (0.37) ADATLR8GPR84ALDH1A1SMN1; SMN2
SCHEMBL5329194 0.82 ALDH1A1 (0.37) ADATLR8GPR84ALDH1A1SMN1; SMN2
SCHEMBL5325831 0.82 ALDH1A1 (0.37) ADATLR8GPR84ALDH1A1SMN1; SMN2
SCHEMBL5334530 0.82 ALDH1A1 (0.37) ADATLR8GPR84ALDH1A1SMN1; SMN2
SCHEMBL5332515 0.82 ALDH1A1 (0.37) ADATLR8GPR84ALDH1A1SMN1; SMN2
SCHEMBL5326288 0.82 ALDH1A1 (0.37) ADATLR8GPR84ALDH1A1SMN1; SMN2
SCHEMBL5327441 0.82 ALDH1A1 (0.37) ADATLR8GPR84ALDH1A1SMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117043298-A Adhesive for temporarily fixing electronic component to solder precoat and method for manufacturing electronic component mounting board 松下知识产权经营株式会社 2023-11-10 CN disclosed