⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4449003 | 1.00 | — | — | |
| SCHEMBL179887 | 0.74 | — | — | |
| SCHEMBL6900368 | 0.74 | — | — | |
| SCHEMBL1908373 | 0.74 | — | — | |
| SCHEMBL2105930 | 0.72 | — | — | |
| SCHEMBL2106616 | 0.72 | TDP1 (0.36) | — | |
| SCHEMBL2105508 | 0.72 | — | — | |
| SCHEMBL2105597 | 0.72 | MMP8 (0.33) | — | |
| SCHEMBL2106479 | 0.72 | MMP8 (0.33) | — | |
| SCHEMBL12214903 | 0.71 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 84 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240158581-A1 | Thermally Conductive Silicone Composition | SOLAREDGE TECHNOLOGIES LTD. (IL) | 2024-05-16 | — | — | US | disclosed |
| EP-4361207-A1 | THERMALLY CONDUCTIVE SILICONE COMPOSITION | Solaredge Technologies Ltd. (IL) | 2024-05-01 | — | — | EP | disclosed |
| CN-117730123-A | Heat conductive silicone composition | 美国陶氏有机硅公司 | 2024-03-19 | — | — | CN | disclosed |
| CN-117255837-A | Silicone composition for forming release cured coating and release sheet | 陶氏东丽株式会社 | 2023-12-19 | — | — | CN | disclosed |
| CN-117043275-A | Organopolysiloxane composition | 陶氏东丽株式会社 | 2023-11-10 | — | — | CN | disclosed |
| CN-113840881-B | Gel-type thermal interface material with low pre-cure viscosity and post-cure elastic properties | 霍尼韦尔国际公司 | 2023-08-01 | — | — | CN | disclosed |
| US-20230193028-A1 | THERMAL CONDUCTIVE SILICONE COMPOSITION | DOW SILICONES CORPORATION | 2023-06-22 | — | — | US | disclosed |
| CN-114430758-B | Method for producing fluorosilicone rubber laminate, and fluorosilicone rubber laminate | 陶氏东丽株式会社 | 2023-06-20 | — | — | CN | disclosed |
| CN-113195614-B | Antistatic silicone rubber composition | 美国陶氏有机硅公司 | 2023-03-21 | — | — | CN | disclosed |
| CN-109417061-B | Gel-type thermal interface material | 霍尼韦尔国际公司 | 2023-02-21 | — | — | CN | disclosed |
| EP-1776420-B1 | CURABLE ORGANOPOLYSILOXANE COMPOSITION | DOW CORNING TORAY CO LTD (JP) | 2010-02-24 | — | — | EP | disclosed |
| US-20080262157-A1 | Curable Organopolysiloxane Composition | DOW CORNING TORAY COMPANY, LTD. (JP) | 2008-10-23 | — | — | US | disclosed |
| EP-1603988-B1 | SOLVENTLESS SILICONE PRESSURE SENSITIVE ADHESIVES WITH IMPROVED HIGH TEMPERATURE COHESIVE STRENGTH | DOW CORNING (US) | 2008-07-02 | — | — | EP | disclosed |
| US-7378482-B2 | Compositions having improved bath life | DOW CORNING CORPORATION (US) | 2008-05-27 | — | — | US | disclosed |
| EP-1499679-B1 | COMPOSITIONS HAVING IMPROVED BATH LIFE | DOW CORNING (US) | 2007-05-30 | — | — | EP | disclosed |
| US-20060111491-A1 | Compositions having improved bath life | DOW SILICONES CORPORATION | 2006-05-25 | — | — | US | disclosed |
| US-6822066-B2 | POLYSILOXANE, NONAROMATIC DI- OR TRICYCLIC NONAROMATIC POLYENE, AND CATALYST; HEAT RESISTANCE, STABILITY | DOW CORNING CORPORATION | 2004-11-23 | — | — | US | disclosed |
| US-20040097639-A1 | Organosiloxane resin-polyene materials | DOW CORNING CORPORATION | 2004-05-20 | — | — | US | disclosed |
| EP-1004632-B1 | Silicone composition for forming cured release films | DOW CORNING TORAY SILICONE (JP) | 2003-12-10 | — | — | EP | disclosed |
| EP-0851000-A2 | Curable adhesive organosilicon compositions | DOW CORNING LIMITED (GB) | 1998-07-01 | — | — | EP | disclosed |