SCHEMBL29201450

SCHEMBL29201450

CCCCc1c(C(C)(C(=O)O)c2ccc(O)c(-n3nc4ccccc4n3)c2CCCC)ccc(O)c1-n1nc2ccccc2n1

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PPARG P37231 1/20 0.40
PPARA Q07869 1/20 0.40
MAPT P10636 4/20 0.37
TDP1 Q9NUW8 1/20 0.37
ALDH1A1 P00352 3/20 0.36
LMNA P02545 3/20 0.36
NPC1 O15118 1/20 0.36
RAB9A P51151 1/20 0.36
SMN1; SMN2 Q16637 2/20 0.35
KDM4E B2RXH2 4/20 0.35
POLB P06746 1/20 0.35
HTT P42858 1/20 0.35
RXFP1 Q9HBX9 1/20 0.35
MAPK1 P28482 1/20 0.34
HPGD P15428 2/20 0.33
TP53 P04637 1/20 0.33
PARP1 P09874 1/20 0.33
AGTR1 P30556 1/20 0.32
AGTR2 P50052 1/20 0.32
TACR3 P29371 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1921750 0.74 NPC1 (0.41) MAPTALDH1A1LMNANPC1RAB9A
SCHEMBL1921992 0.74 NPC1 (0.41) MAPTALDH1A1LMNANPC1RAB9A
SCHEMBL673476 0.72 NPC1 (0.38) PPARGPPARAALDH1A1LMNANPC1
SCHEMBL4638119 0.71 HTT (0.44) MAPTTDP1ALDH1A1LMNANPC1
SCHEMBL28884858 0.69 NPC1 (0.41) PPARGPPARAALDH1A1LMNANPC1
SCHEMBL672683 0.68 PPARG (0.46) PPARGPPARAMAPTTDP1ALDH1A1
SCHEMBL5846684 0.68 NPC1 (0.44) PPARGPPARAALDH1A1LMNANPC1
SCHEMBL7160541 0.68 F2R (0.38) ALDH1A1KDM4EPOLBHTTRXFP1
SCHEMBL5614110 0.66 MEN1 (0.38) MAPTTDP1NPC1RAB9AKDM4E
SCHEMBL135250 0.66 HDAC6 (0.38) PPARGPPARALMNANPC1RAB9A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117631452-A Photosensitive paste, wiring pattern forming method, electronic component manufacturing method, and electronic component 株式会社村田制作所 2024-03-01 CN disclosed