SCHEMBL2921023

SCHEMBL2921023

C[CH]c1cccc(CCCCCCC)c1

nearest known ligand 0.59

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
LPL P06858 3/20 0.54
LIPG Q9Y5X9 3/20 0.54
PPARA Q07869 5/20 0.47
PPARG P37231 3/20 0.47
KCNH2 Q12809 1/20 0.44
TDP1 Q9NUW8 1/20 0.43
L3MBTL1 Q9Y468 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL677064 1.00 LPL (0.54) LPLLIPGPPARAPPARGKCNH2
SCHEMBL677009 1.00 LPL (0.54) LPLLIPGPPARAPPARGKCNH2
SCHEMBL677236 0.98 LPL (0.53) LPLLIPGPPARAPPARGTDP1
SCHEMBL2918719 0.93 LPL (0.46) LPLLIPGPPARAPPARGTDP1
SCHEMBL28305258 0.86 LPL (0.51) LPLLIPGPPARAPPARGKCNH2
SCHEMBL2920783 0.85 CNR1 (0.39) LPLLIPG
SCHEMBL11431846 0.84 LPL (0.53) LPLLIPGPPARAPPARGKCNH2
SCHEMBL489093 0.84 LPL (0.53) LPLLIPGPPARAPPARGTDP1
SCHEMBL11429526 0.84 LPL (0.53) LPLLIPGPPARAPPARGKCNH2
SCHEMBL4083034 0.84 LPL (0.53) LPLLIPGPPARAPPARG

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1467251-B1 Positive resist composition FUJIFILM CORP (JP) 2010-09-08 EP disclosed
US-20080096130-A1 POSITIVE RESIST COMPOSITION FUJIFILM CORPORATION 2008-04-24 US disclosed
US-7361446-B2 Sensitivity, high resolution, good pattern profile, used for super-microlithography FUJIFILM CORPORATION (JP) 2008-04-22 US disclosed
EP-1467251-A1 Positive resist composition Fuji Photo Film Co., Ltd. (JP) 2004-10-13 EP disclosed
US-20040197702-A1 Positive resist composition FUJI PHOTO FILM CO., LTD. 2004-10-07 US disclosed
US-6727033-B2 A POSITIVE RESIST COMPOSITION COMPRISING A RESIN (A), WHICH IS DECOMPOSED BY THE ACTION OF AN ACID TO INCREASE SOLUBILITY IN AN ALKALI DEVELOPING SOLUTION, CONTAINING A STRUCTURAL UNIT INCLUDING A GROUP REPRESENTED BY FORMULA (X) DEFINED IN FUJI PHOTO FILM CO., LTD. (JP) 2004-04-27 US disclosed
US-20030134221-A1 Positive resist composition FUJI PHOTO FILM CO., LTD. 2003-07-17 US disclosed