SCHEMBL2921024

SCHEMBL2921024

[CH2]Cc1cccc(CCCCCCC)c1

nearest known ligand 0.62

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
LPL P06858 3/20 0.57
LIPG Q9Y5X9 3/20 0.57
PPARG P37231 2/20 0.49
PPARA Q07869 2/20 0.49
KCNH2 Q12809 1/20 0.46
SPHK2 Q9NRA0 3/20 0.46
SPHK1 Q9NYA1 2/20 0.46
TDP1 Q9NUW8 1/20 0.46
L3MBTL1 Q9Y468 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL677065 1.00 LPL (0.57) LPLLIPGPPARGPPARAKCNH2
SCHEMBL29248328 1.00 LPL (0.57) LPLLIPGPPARGPPARAKCNH2
SCHEMBL677010 1.00 LPL (0.57) LPLLIPGPPARGPPARAKCNH2
SCHEMBL677237 0.98 LPL (0.56) LPLLIPGPPARGPPARASPHK2
SCHEMBL2918721 0.92 LPL (0.49) LPLLIPGPPARGPPARATDP1
SCHEMBL4032533 0.90 LPL (0.67) LPLLIPGPPARGPPARAKCNH2
SCHEMBL29742685 0.90 LPL (0.67) LPLLIPGPPARGPPARAKCNH2
SCHEMBL6932623 0.90 LPL (0.67) LPLLIPGPPARGPPARAKCNH2
SCHEMBL5249436 0.90 LPL (0.67) LPLLIPGPPARGPPARAKCNH2
SCHEMBL10518886 0.90 LPL (0.67) LPLLIPGPPARGPPARAKCNH2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1467251-B1 Positive resist composition FUJIFILM CORP (JP) 2010-09-08 EP disclosed
US-20080096130-A1 POSITIVE RESIST COMPOSITION FUJIFILM CORPORATION 2008-04-24 US disclosed
US-7361446-B2 Sensitivity, high resolution, good pattern profile, used for super-microlithography FUJIFILM CORPORATION (JP) 2008-04-22 US disclosed
EP-1467251-A1 Positive resist composition Fuji Photo Film Co., Ltd. (JP) 2004-10-13 EP disclosed
US-20040197702-A1 Positive resist composition FUJI PHOTO FILM CO., LTD. 2004-10-07 US disclosed
US-6727033-B2 A POSITIVE RESIST COMPOSITION COMPRISING A RESIN (A), WHICH IS DECOMPOSED BY THE ACTION OF AN ACID TO INCREASE SOLUBILITY IN AN ALKALI DEVELOPING SOLUTION, CONTAINING A STRUCTURAL UNIT INCLUDING A GROUP REPRESENTED BY FORMULA (X) DEFINED IN FUJI PHOTO FILM CO., LTD. (JP) 2004-04-27 US disclosed
US-20030134221-A1 Positive resist composition FUJI PHOTO FILM CO., LTD. 2003-07-17 US disclosed