SCHEMBL29290201

SCHEMBL29290201

Cc1ccccc1C(=O)OC(O)O

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ADRB2 P07550 2/20 0.49
ADRB1 P08588 2/20 0.49
ADRB3 P13945 2/20 0.49
SMN1; SMN2 Q16637 1/20 0.49
KDM4E B2RXH2 1/20 0.48
NPC1 O15118 3/20 0.47
RAB9A P51151 2/20 0.47
UTS2R Q9UKP6 1/20 0.47
KMT2A Q03164 5/20 0.45
MEN1 O00255 4/20 0.45
ESR1 P03372 1/20 0.45
ESR2 Q92731 1/20 0.45
MAPT P10636 2/20 0.44
LMNA P02545 1/20 0.44
TSHR P16473 1/20 0.44
PLK1 P53350 1/20 0.43
PLK2 Q9NYY3 1/20 0.43
CASP3 P42574 1/20 0.43
SENP8 Q96LD8 1/20 0.43
SENP7 Q9BQF6 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27681565 0.86 ADRB2 (0.51) ADRB2ADRB1ADRB3SMN1; SMN2KDM4E
SCHEMBL1786549 0.84 SMN1; SMN2 (0.52) ADRB2ADRB1ADRB3SMN1; SMN2KDM4E
SCHEMBL277670 0.84 NPC1 (0.56) ADRB2ADRB1ADRB3SMN1; SMN2KDM4E
SCHEMBL28277740 0.82 NPC1 (0.50) ADRB2ADRB1ADRB3SMN1; SMN2KDM4E
SCHEMBL27773268 0.82 SMN1; SMN2 (0.48) ADRB2ADRB1ADRB3SMN1; SMN2KDM4E
SCHEMBL27637585 0.82 SMN1; SMN2 (0.48) ADRB2ADRB1ADRB3SMN1; SMN2KDM4E
SCHEMBL4179476 0.81 TSHR (0.58) ADRB2ADRB1ADRB3SMN1; SMN2KDM4E
SCHEMBL697167 0.81 TSHR (0.58) ADRB2ADRB1ADRB3SMN1; SMN2KDM4E
SCHEMBL6890551 0.81 SMN1; SMN2 (0.50) ADRB2ADRB1ADRB3SMN1; SMN2KDM4E
SCHEMBL31231255 0.81 SMN1; SMN2 (0.50) ADRB2ADRB1ADRB3SMN1; SMN2KDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-109563343-A Resin combination uses its sheet material, laminated body, power semiconductor, plasma processing apparatus and method for making semiconductor 东丽株式会社 2019-04-02 CN disclosed