SCHEMBL29322694

SCHEMBL29322694

CC(Cl)CNC(C)(C)C(C)C

nearest known ligand 0.33

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
PIK3CD O00329 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3156858 0.80 PIK3CD (0.33) PIK3CD
SCHEMBL4366444 0.76 ALDH1A1 (0.32) PIK3CD
SCHEMBL1833054 0.71
SCHEMBL22996221 0.70
SCHEMBL21076326 0.70 PIK3CD (0.32) PIK3CD
SCHEMBL24261156 0.69
SCHEMBL7965445 0.69
SCHEMBL6719971 0.69
SCHEMBL7965442 0.69
SCHEMBL2724335 0.67 PIK3CD (0.32) PIK3CD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4400534-A1 POLYMER, LEVELER AND PREPARATION METHOD THEREFOR, ELECTROPLATING SOLUTION AND ELECTROPLATING METHOD Huawei Technologies Co., Ltd. (CN) 2024-07-17 EP disclosed