SCHEMBL29334491

SCHEMBL29334491

CNC(=O)c1cccc(C(=O)NCc2c(F)c(F)c(C)c(F)c2F)c1

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ HDAC8 Q9BY41 2/20 0.50
▸ HDAC6 Q9UBN7 2/20 0.50
▸ F10 P00742 1/20 0.45
▸ KMT2A Q03164 3/20 0.44
▸ GAA P10253 2/20 0.44
▸ HSD17B10 Q99714 2/20 0.44
▸ MMP13 P45452 1/20 0.44
▸ HDAC2 Q92769 1/20 0.43
▸ SMN1; SMN2 Q16637 1/20 0.43
▸ HPGD P15428 1/20 0.42
▸ POLB P06746 1/20 0.42
▸ PRMT5 O14744 1/20 0.41
▸ HTT P42858 1/20 0.41
▸ NQO2 P16083 1/20 0.40
▸ SLC7A5 Q01650 1/20 0.40
▸ MAPK14 Q16539 1/20 0.40
▸ ALDH1A1 P00352 2/20 0.40
▸ MEN1 O00255 1/20 0.40
▸ CA1 P00915 1/20 0.40
▸ CA2 P00918 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29332486 0.88 MAPK14 (0.48) HDAC8HDAC6F10KMT2AGAA
SCHEMBL29335650 0.80 BRD4 (0.45) F10KMT2AGAAMMP13HPGD
SCHEMBL26204809 0.80 CFD (0.44) HDAC8HDAC6KMT2AGAAHSD17B10
SCHEMBL25888179 0.77 HDAC6 (0.64) HDAC8HDAC6KMT2AGAAHSD17B10
SCHEMBL29334490 0.76 BRD4 (0.44) KMT2AGAAMMP13SMN1; SMN2HPGD
SCHEMBL18732773 0.76 HDAC8 (0.62) HDAC8HDAC6KMT2AGAAHSD17B10
SCHEMBL29332849 0.75 TSHR (0.58) HDAC8HDAC6KMT2AMMP13HDAC2
SCHEMBL5909363 0.74 HDAC8 (0.83) HDAC8HDAC6KMT2AGAAHSD17B10
SCHEMBL26312411 0.74 HDAC8 (0.65) HDAC8HDAC6KMT2AGAAHSD17B10
SCHEMBL3508286 0.72 NPC1 (0.53) HDAC8HDAC6KMT2AGAAHSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240240024-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER USING THE SAME, AND COLOR FILTER SAMSUNG SDI CO., LTD. (KR) 2024-07-18 — — US disclosed
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