⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30445586 | 1.00 | — | — | |
| SCHEMBL29663004 | 1.00 | — | — | |
| SCHEMBL31515078 | 0.82 | — | — | |
| SCHEMBL31020876 | 0.82 | — | — | |
| SCHEMBL29409802 | 0.82 | — | — | |
| Selenium SCHEMBL30989326 | 0.82 | — | — | |
| SCHEMBL30989357 | 0.82 | — | — | |
| Lithium SCHEMBL31285731 | 0.82 | — | — | |
| SCHEMBL31277184 | 0.82 | — | — | |
| SCHEMBL30204768 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Appears in 5335 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-122091303-A | Low-temperature conductive paste for metal plate printing and preparation method thereof | — | 2026-05-26 | — | — | CN | claimed |
| CN-122094543-A | High vacuum normal temperature bonding method | — | 2026-05-26 | — | — | CN | claimed |
| CN-121463573-B | Photovoltaic cell, manufacturing method thereof, laminated cell and photovoltaic module | Jingke energy (Haining) Co.,Ltd. (CN) | 2026-05-26 | — | — | CN | claimed |
| CN-224288015-U | Low-loss solid-state capacitor | Dongguan Dongchengxin Electronics Co.,Ltd. (CN) | 2026-05-26 | — | — | CN | claimed |
| US-20260144065-A1 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES | Amkor Technology Singapore Holding Pte. Ltd. (SG) | 2026-05-21 | — | — | US | claimed |
| WO-2026101697-A1 | PROCESS CONTROL OF SEMICONDUCTOR FABRICATION EQUIPMENT USING ULTRASONIC SENSORS | LAM RESEARCH CORPORATION (US) | 2026-05-15 | — | — | WO | claimed |
| CN-122016876-A | Method and device for testing champagne bubbles in surface treatment of silver PCB (printed circuit board), computer equipment and storage medium | 江西景旺精密电路有限公司 | 2026-05-12 | — | — | CN | claimed |
| EP-4739077-A1 | A METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND CORRESPONDING SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR PACKAGE | Nexperia B.V. (NL) | 2026-05-06 | — | — | EP | claimed |
| US-20260123507-A1 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND CORRESPONDING SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR PACKAGE | NEXPERIA B.V. (NL) | 2026-04-30 | — | — | US | claimed |
| US-20260114331-A1 | POP STRUCTURE OF THREE-DIMENSIONAL FAN-OUT MEMORY AND PACKAGING METHOD THEREOF | SJ SEMICONDUCTOR(JIANGYIN) CORPORATION (CN) | 2026-04-23 | — | — | US | claimed |
| US-20220059423-A1 | ELECTRONIC DEVICES IN SEMICONDUCTOR PACKAGE CAVITIES | TEXAS INSTRUMENTS INCORPORATED | 2022-02-24 | — | — | US | claimed |
| CN-215869383-U | Package structure with interconnected multiple flip chips stacked | 芯原微电子(南京)有限公司 | 2022-02-18 | — | — | CN | claimed |
| CN-110653516-B | Special soldering paste for welding multistage packaging patch elements | 深圳群崴半导体材料有限公司 | 2022-02-15 | — | — | CN | claimed |
| CN-112382579-B | Coating manufacturing process for wafer under bump metallization and coating structure thereof | 深圳市创智成功科技有限公司 | 2022-02-15 | — | — | CN | claimed |
| CN-114049981-A | Silver-tin nano material conductive silver paste and application thereof to vacuum glass | 重庆英诺维节能环保科技有限公司 | 2022-02-15 | — | — | CN | claimed |
| US-11247027-B2 | Guidewire having a distal-end brazing member formed with different brazing portions | ASAHI INTECC CO., LTD. (JP) | 2022-02-15 | — | — | US | claimed |
| CN-111128913-B | Flip-chip welding packaging structure and method thereof | 中国航空工业集团公司北京长城航空测控技术研究所 | 2022-02-11 | — | — | CN | claimed |
| WO-2022032062-A1 | METHOD OF ATTACHING A CONNECTOR TO A GLAZING | CARLEX GLASS AMERICA, LLC (US) | 2022-02-10 | — | — | WO | claimed |
| CN-114012303-A | Low-temperature solder and preparation method thereof | 宁波佳明金属制品有限公司 | 2022-02-08 | — | — | CN | claimed |
| CN-114005760-A | Preparation method of semiconductor packaging substrate | 苏州群策科技有限公司 | 2022-02-01 | — | — | CN | claimed |