SCHEMBL31020876

SCHEMBL31020876

[Ag].[In].[Sn].[Sn]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29353941 1.00
SCHEMBL29540917 0.87
SCHEMBL31738501 0.87
SCHEMBL29697504 0.87
SCHEMBL11684099 0.87
SCHEMBL30167058 0.87
SCHEMBL29377074 0.87
SCHEMBL4385132 0.87
SCHEMBL31365278 0.87
SCHEMBL29509702 0.82

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115519275-B Lead-free solder paste without soldering flux residue and preparation method thereof 上海华庆焊材技术股份有限公司 2024-08-09 CN disclosed