Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP2C19 | P33261 | 6/20 | 0.46 |
| ▸ | LMNA | P02545 | 5/20 | 0.46 |
| ▸ | TSHR | P16473 | 5/20 | 0.46 |
| ▸ | CYP3A4 | P08684 | 4/20 | 0.46 |
| ▸ | CYP1A2 | P05177 | 4/20 | 0.46 |
| ▸ | TDP1 | Q9NUW8 | 3/20 | 0.46 |
| ▸ | MEN1 | O00255 | 3/20 | 0.46 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.46 |
| ▸ | CYP2D6 | P10635 | 3/20 | 0.46 |
| ▸ | HTR1A | P08908 | 2/20 | 0.46 |
| ▸ | ADRA2A | P08913 | 2/20 | 0.46 |
| ▸ | CHRM2 | P08172 | 1/20 | 0.46 |
| ▸ | CHRM4 | P08173 | 1/20 | 0.46 |
| ▸ | CHRM5 | P08912 | 1/20 | 0.46 |
| ▸ | CHRM1 | P11229 | 1/20 | 0.46 |
| ▸ | ADRA2B | P18089 | 1/20 | 0.46 |
| ▸ | ADRA2C | P18825 | 1/20 | 0.46 |
| ▸ | ADRA1D | P25100 | 1/20 | 0.46 |
| ▸ | HTR1D | P28221 | 1/20 | 0.46 |
| ▸ | HTR1B | P28222 | 1/20 | 0.46 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL26717 | 1.00 | CYP2C19 (0.46) | CYP2C19LMNATSHRCYP3A4CYP1A2 | |
| SCHEMBL14268294 | 0.96 | CYP2C19 (0.43) | CYP2C19LMNATSHRCYP3A4CYP1A2 | |
| SCHEMBL24520502 | 0.94 | CYP3A4 (0.42) | CYP2C19LMNATSHRCYP3A4CYP1A2 | |
| SCHEMBL13302848 | 0.91 | TSHR (0.42) | CYP2C19LMNATSHRCYP3A4CYP1A2 | |
| SCHEMBL14188051 | 0.91 | CYP2C19 (0.40) | CYP2C19LMNATSHRCYP3A4CYP1A2 | |
| SCHEMBL31300111 | 0.86 | TDP1 (0.37) | CYP2C19LMNATSHRCYP3A4CYP1A2 | |
| SCHEMBL29438281 | 0.85 | HSPA5 (0.43) | CYP2C19LMNATSHRCYP3A4CYP1A2 | |
| SCHEMBL20592362 | 0.85 | MEN1 (0.33) | CYP2C19LMNATSHRCYP3A4CYP1A2 | |
| SCHEMBL27170337 | 0.85 | CYP2C19 (0.44) | CYP2C19LMNATSHRCYP3A4CYP1A2 | |
| SCHEMBL6562169 | 0.85 | HSPA5 (0.43) | CYP2C19LMNATSHRCYP3A4CYP1A2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20250201760-A1 | HYBRID BONDING INSULATION MEMBRANE FORMING MATERIAL, METHOD OF PRODUCING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE | HD MICROSYSTEMS, LTD. (JP) | 2025-06-19 | — | — | US | disclosed |
| CN-119768482-A | Adhesive composition, adhesive sheet, optical film with adhesive sheet, and method for producing adhesive sheet and optical film with adhesive sheet | 日东电工株式会社 | 2025-04-04 | — | — | CN | disclosed |
| CN-119630751-A | Adhesive sheet, optical film with adhesive sheet, and method for producing adhesive sheet and optical film with adhesive sheet | 日东电工株式会社 | 2025-03-14 | — | — | CN | disclosed |
| CN-119585384-A | Method for producing adhesive sheet and method for producing optical film with adhesive sheet | 日东电工株式会社 | 2025-03-07 | — | — | CN | disclosed |
| CN-118946610-A | Hybrid bond insulating film forming material, method for manufacturing semiconductor device, and semiconductor device | 艾曲迪微系统股份有限公司 | 2024-11-12 | — | — | CN | disclosed |
| WO-2023195202-A1 | HYBRID BONDING INSULATION FILM-FORMING MATERIAL, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | ＨＤマイクロシステムズ株式会社 | 2023-10-12 | — | — | WO | disclosed |
| WO-2023181637-A1 | HYBRID BONDING INSULATION FILM-FORMING MATERIAL, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | ＨＤマイクロシステムズ株式会社 | 2023-09-28 | — | — | WO | disclosed |
| WO-2023171014-A1 | INSULATION FILM FORMING MATERIAL, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE | ＨＤマイクロシステムズ株式会社 | 2023-09-14 | — | — | WO | disclosed |
| WO-2023127523-A1 | RESIN COMPOSITION, MULTILAYER SHEET, PREPREG, CURED PRODUCT, SUBSTRATE WITH CURED PRODUCT, AND ELECTRONIC DEVICE | 東洋インキＳＣホールディングス株式会社 | 2023-07-06 | — | — | WO | disclosed |
| WO-2023038092-A1 | PHOTOSENSITIVE COMPOSITION, CURED FILM OBTAINED THEREFROM, COLOR FILTER, OPTICAL FILTER, IMAGE DISPLAY DEVICE, SOLID IMAGING ELEMENT, AND INFRARED SENSOR | 東洋インキＳＣホールディングス株式会社 | 2023-03-16 | — | — | WO | disclosed |
| CN-115700411-A | Photosensitive composition, optical filter, image display device, and solid-state imaging element | 东洋油墨SC控股株式会社 | 2023-02-07 | — | — | CN | disclosed |
| CN-115685673-A | Photosensitive composition, optical filter, image display device, and solid-state imaging element | 东洋油墨SC控股株式会社 | 2023-02-03 | — | — | CN | disclosed |
| CN-111819258-B | Reinforced film | 日东电工株式会社 | 2022-12-23 | — | — | CN | disclosed |
| WO-2022211082-A1 | PHOTOSENSITIVE FILM LAMINATED BODY, CURED PRODUCT, AND PRINTED CIRCUIT BOARD | 太陽インキ製造株式会社 | 2022-10-06 | — | — | WO | disclosed |
| CN-107817649-B | Photosensitive resin composition, polyamide resin and method for producing same, compound and method for producing same, cured film and method for producing same | 东京应化工业株式会社 | 2022-09-16 | — | — | CN | disclosed |
| WO-2022071329-A1 | RESIN COMPOSITION, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, CURED OBJECT, SEMICONDUCTOR DEVICE, AND METHOD FOR SYNTHESIZING POLYIMIDE PRECURSOR | 昭和電工マテリアルズ株式会社 | 2022-04-07 | — | — | WO | disclosed |
| WO-2022070362-A1 | RESIN COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, CURED PRODUCT, AND SEMICONDUCTOR DEVICE | 昭和電工マテリアルズ株式会社 | 2022-04-07 | — | — | WO | disclosed |
| CN-113969123-A | Adhesive composition, adhesive sheet, polarizing plate with adhesive, and image display device | 日东电工株式会社 | 2022-01-25 | — | — | CN | disclosed |
| CN-113969118-A | Adhesive sheet, adhesive-attached polarizing plate, image display device, and method for manufacturing same | 日东电工株式会社 | 2022-01-25 | — | — | CN | disclosed |