SCHEMBL29353259

SCHEMBL29353259

CCCCCCCCCCCCCC(CC(=O)O)(C(=O)O)C(CCCCCCCCCCCCC)(CC(=O)OC1CC(C)(C)N(C)C(C)(C)C1)C(=O)OC1CC(C)(C)N(C)C(C)(C)C1

nearest known ligand 0.34

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
NAAA Q02083 2/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29705777 0.96 NAAA (0.34) NAAA
SCHEMBL29349884 0.87 GAA (0.35) NAAA
SCHEMBL11463956 0.81 NAAA (0.36) NAAA
SCHEMBL2402463 0.74 MLNR (0.30)
Succinic Acid SCHEMBL31489936 0.74 NAAA (0.52) NAAA
SCHEMBL3788077 0.73
SCHEMBL813540 0.73
SCHEMBL13075208 0.73 NAAA (0.58) NAAA
SCHEMBL15300099 0.73 NAAA (0.58) NAAA
SCHEMBL14525070 0.73 NAAA (0.58) NAAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4271511-B1 MOLECULAR ARRAY GENERATION USING PHOTORESIST 10X GENOMICS INC (US) 2024-10-09 EP disclosed
EP-4405094-A1 HIGH DEFINITION MOLECULAR ARRAY FEATURE GENERATION USING PHOTORESIST 10X Genomics, Inc. (US) 2024-07-31 EP disclosed
EP-4350057-A1 THERMOPLASTIC RESIN COMPOSITION, METHOD FOR PRODUCING SHAPED BODY, SHAPED BODY AND USE OF RESIN MATERIAL ADEKA CORPORATION (JP) 2024-04-10 EP disclosed
US-20240076656-A1 HIGH DEFINITION MOLECULAR ARRAY FEATURE GENERATION USING PHOTORESIST 10X GENOMICS, INC. (US) 2024-03-07 US disclosed
WO-2024048524-A1 ANTISTATIC AGENT, ANTISTATIC AGENT COMPOSITION CONTAINING SAME, ANTISTATIC RESIN COMPOSITION CONTAINING SAID ANTISTATIC AGENT OR SAID ANTISTATIC AGENT COMPOSITION, AND MOLDED BODY AND FILM THEREOF 株式会社ADEKA 2024-03-07 WO disclosed
WO-2024006827-A1 METHODS AND SYSTEMS FOR LIGHT-CONTROLLED SURFACE PATTERNING USING PHOTOMASKS 10X GENOMICS, INC. (US) 2024-01-04 WO disclosed
WO-2024006798-A1 HIGH DEFINITION MOLECULAR ARRAY FEATURE GENERATION USING PHOTORESIST 10X GENOMICS, INC. (US) 2024-01-04 WO disclosed
WO-2024006799-A1 COVALENT ATTACHMENT OF SPLINT OLIGONUCLEOTIDES FOR MOLECULAR ARRAY GENERATION USING LIGATION 10X GENOMICS, INC. (US) 2024-01-04 WO disclosed
WO-2023199865-A1 FLAME RETARDANT COMPOSITION, FLAME-RETARDANT RESIN COMPOSITION AND MOLDED ARTICLE 株式会社ADEKA 2023-10-19 WO disclosed
CN-115087702-A Styrene resin composition, flame-retardant styrene resin composition, molded article, and patch antenna PS日本株式会社 2022-09-20 CN disclosed
CN-114929801-A Flame retardant composition, flame-retardant resin composition, and molded article 株式会社ADEKA 2022-08-19 CN disclosed
CN-107001762-B Acrylic resin composition and laminate obtained by laminating the same 株式会社艾迪科 2022-08-09 CN disclosed
CN-109937323-B Light-absorbing film and backlight unit 富士胶片株式会社 2022-06-24 CN disclosed
WO-2022118751-A1 AMINE RESISTANCE IMPARTING AGENT FOR VINYL CHLORIDE RESIN 株式会社ADEKA 2022-06-09 WO disclosed
WO-2022107732-A1 INK COMPOSITION 株式会社DNPファインケミカル 2022-05-27 WO disclosed
CN-113966359-A Additive composition 株式会社艾迪科 2022-01-21 CN disclosed