SCHEMBL29356263

SCHEMBL29356263

C=CC(=O)OC1CC(O)CO1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2400356 0.84
SCHEMBL12796176 0.73
SCHEMBL1277383 0.72
SCHEMBL20543231 0.72
SCHEMBL12796056 0.70
SCHEMBL12796173 0.69
SCHEMBL280547 0.68 EPHX2 (0.32)
SCHEMBL61154 0.68 LMNA (0.32)
SCHEMBL12796059 0.68
SCHEMBL12796075 0.68

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12449731-B2 Photosensitive resin composition, method for producing resist pattern film, and method for producing plated formed product ISR CORPORATION (JP) 2025-10-21 US disclosed
WO-2025041686-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING RESIST PATTERN FILM, AND METHOD FOR PRODUCING PLATED SHAPED ARTICLE JSR株式会社 2025-02-27 WO disclosed
WO-2025041685-A1 PHOTOSENSITIVE RESIN COMPOSITION FOR PRODUCING PLATED MOLDED ARTICLE, METHOD FOR PRODUCING RESIST PATTERN FILM, AND METHOD FOR PRODUCING PLATED MOLDED ARTICLE JSR株式会社 2025-02-27 WO disclosed
CN-112534353-B Photosensitive resin composition, method for forming resist pattern, method for producing plated molded article, and semiconductor device JSR株式会社 2024-12-24 CN disclosed
US-12174538-B2 Photosensitive resin composition, method for producing resist pattern film, method for producing plated formed product, and method for producing tin-silver plated-formed product JSR CORPORATION (JP) 2024-12-24 US disclosed
US-12158700-B2 Photosensitive resin composition, method for forming resist pattern, method for manufacturing plated molded article, and semiconductor apparatus JSR CORPORATION (JP) 2024-12-03 US disclosed
WO-2024190595-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING RESIST PATTERN FILM, AND METHOD FOR PRODUCING PLATED SHAPED ARTICLE JSR株式会社 2024-09-19 WO disclosed
US-20230036031-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING RESIST PATTERN FILM, METHOD FOR PRODUCING PLATED FORMED PRODUCT, AND METHOD FOR PRODUCING TIN-SILVER PLATED-FORMED PRODUCT JSR CORPORATION (JP) 2023-02-02 US disclosed
US-20220057714-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING RESIST PATTERN FILM, AND METHOD FOR PRODUCING PLATED FORMED PRODUCT JSR CORPORATION (JP) 2022-02-24 US disclosed
US-20220035246-A1 METHOD FOR PRODUCING PLATED FORMED PRODUCT JSR CORPORATION (JP) 2022-02-03 US disclosed
US-20220026802-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING RESIST PATTERN FILM, AND METHOD FOR PRODUCING PLATED FORMED PRODUCT JSR CORPORATION (JP) 2022-01-27 US disclosed