SCHEMBL29358441

SCHEMBL29358441

CCCOC(C)(O)O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL997577 0.81 TSHR (0.33)
SCHEMBL1262868 0.81
SCHEMBL28187812 0.79
SCHEMBL8769729 0.78 CES1 (0.45)
SCHEMBL5697594 0.78 HSD17B10 (0.32)
SCHEMBL11289016 0.78
SCHEMBL29219480 0.77 TSHR (0.31)
SCHEMBL4751585 0.77
SCHEMBL5013568 0.75
SCHEMBL9046098 0.75

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-122054878-A Method for manufacturing light-emitting device, negative-type radiation-sensitive composition, cured film, and organic EL device JSR株式会社 2026-05-15 CN disclosed
US-20260026281-A1 METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE AND UNDERLAYER FILM-FORMING COMPOSITION JSR CORPORATION (JP) 2026-01-22 US disclosed
WO-2025033138-A1 METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE AND COMPOSITION FOR FORMING UNDERLAYER FILM FOR METAL-CONTAINING RESIST JSR株式会社 2025-02-13 WO disclosed
US-20250044701-A1 METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE AND SILICON-CONTAINING COMPOSITION JSR CORPORATION (JP) 2025-02-06 US disclosed
WO-2025009380-A1 SEMICONDUCTOR SUBSTRATE MANUFACTURING METHOD AND REVERSAL PATTERN FORMING MATERIAL JSR株式会社 2025-01-09 WO disclosed
WO-2024205936-A1 GAS RELEASING UNDERLAYERS FOR PHOTOPATTERNABLE ORGANOMETALLIC RESIST INPRIA CORPORATION (US) 2024-10-03 WO disclosed
WO-2024203400-A1 METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE AND UNDERLAYER FILM-FORMING COMPOSITION FOR METAL-CONTAINING RESIST JSR株式会社 2024-10-03 WO disclosed
US-20240319599-A1 GAS RELEASING UNDERLAYERS FOR PHOTOPATTERNABLE ORGANOMETALLIC RESIST JSR CORPORATION (JP) 2024-09-26 US disclosed
US-12098282-B2 Film-forming composition, silicon-containing film, and resist pattern-forming method JSR CORPORATION (JP) 2024-09-24 US disclosed
WO-2024135316-A1 COMPOSITION, AND METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE JSR株式会社 2024-06-27 WO disclosed
US-20240004297-A1 COMPOSITION AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE JSR CORPORATION (JP) 2024-01-04 US disclosed
WO-2023204078-A1 METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE AND SILICON-CONTAINING COMPOSITION JSR株式会社 2023-10-26 WO disclosed
US-20230213860-A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COM+POSITION AND CURED FILM PREPARED THEREFROM ROHM & HAAS ELECT MATERIALS KOREA LTD (KR) 2023-07-06 US disclosed
CN-113039253-B Double-liquid mixed adhesive 株式会社E-TEC 2023-05-12 CN disclosed
CN-109563376-B Two-liquid mixed adhesive 株式会社E-TEC 2022-07-05 CN disclosed
US-20220146940-A1 COMPOSITION, SILICON-CONTAINING FILM, METHOD OF FORMING SILICON-CONTAINING FILM, AND METHOD OF TREATING SEMICONDUCTOR SUBSTRATE JSR CORPORATION (JP) 2022-05-12 US disclosed
US-11274233-B2 Two-component adhesive EMULSION TECHNOLOGY CO., LTD. (JP) 2022-03-15 US disclosed
US-20220025232-A1 TWO-COMPONENT ADHESIVE EMULSION TECHNOLOGY CO., LTD. (JP) 2022-01-27 US disclosed