⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29358840 | 1.00 | — | — | |
| SCHEMBL5671250 | 1.00 | — | — | |
| SCHEMBL31532950 | 0.82 | — | — | |
| SCHEMBL715758 | 0.82 | — | — | |
| SCHEMBL31258308 | 0.82 | — | — | |
| SCHEMBL5067798 | 0.82 | — | — | |
| Charcoal, Activated SCHEMBL11150029 | 0.82 | — | — | |
| SCHEMBL11489224 | 0.82 | — | — | |
| SCHEMBL8832642 | 0.82 | — | — | |
| SCHEMBL5271385 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 803 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20260103001-A1 | INKJET CHIP STRUCTURE | MICROJET TECHNOLOGY CO., LTD. (TW) | 2026-04-16 | — | — | US | claimed |
| US-12484257-B2 | Method of forming gate structures for nanostructures | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD (TW) | 2025-11-25 | — | — | US | claimed |
| US-20250319698-A1 | INKJET CHIP STRUCTURE | MICROJET TECHNOLOGY CO., LTD. (TW) | 2025-10-16 | — | — | US | claimed |
| US-20250169169-A1 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | UNITED MICROELECTRONICS CORP. (TW) | 2025-05-22 | — | — | US | claimed |
| CN-119773371-A | Ink jet head identification element | 研能科技股份有限公司 | 2025-04-08 | — | — | CN | claimed |
| CN-119682396-A | Ink jet chip packaging structure | 研能科技股份有限公司 | 2025-03-25 | — | — | CN | claimed |
| US-20250081498-A1 | SEMICONDUCTOR STRUCTURE | United Semiconductor (Xiamen) Co., Ltd. (CN) | 2025-03-06 | — | — | US | claimed |
| CN-119550730-A | Ink jet chip structure | 研能科技股份有限公司 | 2025-03-04 | — | — | CN | claimed |
| US-12237329-B2 | Semiconductor device and method for fabricating the same | UNITED MICROELECTRONICS CORP. (TW) | 2025-02-25 | — | — | US | claimed |
| US-12218137-B2 | Structure and method for gate-all-around metal-oxide-semiconductor devices with improved channel configurations | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) | 2025-02-04 | — | — | US | claimed |
| US-11674221-B2 | Erosion / corrosion resistant barrier coating | CONAX TECHNOLOGIES (US) | 2023-06-13 | — | — | US | claimed |
| US-11631617-B2 | Scalable device for FINFET technology | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2023-04-18 | — | — | US | claimed |
| US-11437489-B2 | Techniques for forming replacement metal gate for VFET | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2022-09-06 | — | — | US | claimed |
| US-20220278197-A1 | SEMICONDUCTOR DEVICE AND METHOD | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) | 2022-09-01 | — | — | US | claimed |
| CN-114750513-A | Wafer structure | 研能科技股份有限公司 | 2022-07-15 | — | — | CN | claimed |
| CN-114750514-A | Wafer structure | 研能科技股份有限公司 | 2022-07-15 | — | — | CN | claimed |
| US-20220219456-A1 | WAFER STRUCTURE | MICROJET TECHNOLOGY CO., LTD. (TW) | 2022-07-14 | — | — | US | claimed |
| US-20220219454-A1 | WAFER STRUCTURE | MICROJET TECHNOLOGY CO., LTD. (TW) | 2022-07-14 | — | — | US | claimed |
| US-20220149195-A1 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH SIDEWALL OXIDIZED DIELECTRIC | NANYA TECHNOLOGY CORPORATION (TW) | 2022-05-12 | — | — | US | claimed |
| US-11315922-B2 | Fin cut to prevent replacement gate collapse on STI | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2022-04-26 | — | — | US | claimed |