SCHEMBL29366386

SCHEMBL29366386

O=C1C=CC(=O)N1c1ccccc1O

nearest known ligand 0.70

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TLR9 Q9NR96 3/20 0.70
MGLL Q99685 13/20 0.57
FAAH O00519 3/20 0.52
HSP90AA1 P07900 2/20 0.52
PKM P14618 2/20 0.52
NPSR1 Q6W5P4 2/20 0.52
TDP1 Q9NUW8 2/20 0.52
ALDH1A1 P00352 1/20 0.52
CCR6 P51684 1/20 0.52
ATM Q13315 1/20 0.52
KDM4E B2RXH2 1/20 0.50
POLB P06746 1/20 0.50
GAA P10253 1/20 0.50
MAPK1 P28482 1/20 0.45
BRD4 O60885 1/20 0.43
MEN1 O00255 1/20 0.42
MAPT P10636 1/20 0.42
HTT P42858 1/20 0.42
KMT2A Q03164 1/20 0.42
L3MBTL1 Q9Y468 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL142504 1.00 TLR9 (0.70) TLR9MGLLFAAHHSP90AA1PKM
Formaldehyde SCHEMBL28487390 0.96 TLR9 (0.64) TLR9MGLLFAAHHSP90AA1PKM
SCHEMBL9418786 0.84 MGLL (0.81) TLR9MGLLFAAHHSP90AA1PKM
SCHEMBL29216876 0.83 MGLL (0.50) TLR9MGLLFAAHHSP90AA1PKM
SCHEMBL121404 0.83 TLR9 (1.00) TLR9MGLLFAAHHSP90AA1PKM
SCHEMBL29377102 0.83 TLR9 (1.00) TLR9MGLLFAAHHSP90AA1PKM
SCHEMBL30000205 0.79 ESR1 (0.55) TLR9MGLLFAAHHSP90AA1PKM
SCHEMBL27986255 0.79 ESR1 (0.55) TLR9MGLLFAAHHSP90AA1PKM
SCHEMBL8612834 0.77 MGLL (0.59) TLR9MGLLFAAHHSP90AA1PKM
SCHEMBL26659392 0.77 CA12 (0.55) TLR9MGLLHSP90AA1PKMNPSR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 45 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119604817-A Positive photosensitive resin composition 日产化学株式会社 2025-03-11 CN claimed
CN-118834595-A Bio-based modified polyurethane resin coating 长兴化学(天津)有限公司 2024-10-25 CN claimed
CN-116848466-A Positive photosensitive resin composition 日产化学株式会社 2023-10-03 CN claimed
CN-120051729-A Liquid crystal aligning agent, liquid crystal alignment film and liquid crystal display element 日产化学株式会社 2025-05-27 CN disclosed
CN-119856108-A Liquid crystal aligning agent and liquid crystal display element 日产化学株式会社 2025-04-18 CN disclosed
CN-119768741-A Positive photosensitive resin composition 日产化学株式会社 2025-04-04 CN disclosed
CN-119604817-A Positive photosensitive resin composition 日产化学株式会社 2025-03-11 CN disclosed
CN-119585651-A Composition for forming wavelength conversion film 日产化学株式会社 2025-03-07 CN disclosed
CN-112602014-B Method for producing liquid crystal alignment film, and liquid crystal display element 日产化学株式会社 2025-02-11 CN disclosed
CN-112639618-B Negative photosensitive resin composition 日产化学株式会社 2025-01-28 CN disclosed
CN-111683986-B Composition for forming cured film, alignment material, and retardation material 日产化学株式会社 2025-01-10 CN disclosed
CN-113234194-B Copolymer, primer composition, double-layer system and application of double-layer system in double-layer stripping process 北京科华微电子材料有限公司 2022-08-12 CN disclosed
WO-2022168732-A1 POSITIVE-ACTING PHOTOSENSITIVE RESIN COMPOSITION 日産化学株式会社 2022-08-11 WO disclosed
CN-109791352-B Photosensitive resin composition, method for producing conductive pattern, substrate, touch panel, and display 东丽株式会社 2022-07-29 CN disclosed
CN-114432301-A Covalent inhibitor derivative and application thereof in treating virus infection 北京大学 2022-05-06 CN disclosed
WO-2022069948-A1 HIGH TEMPERATURE BENZOXAZINE RESINS, METHODS, AND USES THEREOF KANEKA CORPORATION (JP) 2022-04-07 WO disclosed
WO-2022070946-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, DISPLAY DEVICE, AND METHOD FOR PRODUCING CURED PRODUCT 東レ株式会社 2022-04-07 WO disclosed
CN-114245881-A Photosensitive resin composition 日产化学株式会社 2022-03-25 CN disclosed
CN-114174351-A Resin composition 日产化学株式会社 2022-03-11 CN disclosed
CN-109715747-B Cured film-forming composition 日产化学株式会社 2022-02-01 CN disclosed