Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ACMSD | Q8TDX5 | 7/20 | 0.66 |
| ▸ | HNF4A | P41235 | 2/20 | 0.59 |
| ▸ | MCL1 | Q07820 | 2/20 | 0.59 |
| ▸ | DHFR | P00374 | 1/20 | 0.59 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.54 |
| ▸ | GFER | P55789 | 1/20 | 0.54 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.54 |
| ▸ | RXFP1 | Q9HBX9 | 1/20 | 0.54 |
| ▸ | KMO | O15229 | 1/20 | 0.52 |
| ▸ | DCLRE1B | Q9H816 | 3/20 | 0.52 |
| ▸ | DCLRE1A | Q6PJP8 | 1/20 | 0.52 |
| ▸ | XDH | P47989 | 1/20 | 0.50 |
| ▸ | SLC22A12 | Q96S37 | 1/20 | 0.50 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.50 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.50 |
| ▸ | PTPN1 | P18031 | 1/20 | 0.49 |
| ▸ | CDC25B | P30305 | 2/20 | 0.48 |
| ▸ | CDC25A | P30304 | 1/20 | 0.48 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.48 |
| ▸ | ATM | Q13315 | 1/20 | 0.48 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8999909 | 1.00 | ACMSD (0.66) | ACMSDHNF4AMCL1DHFRKDM4E | |
| SCHEMBL1099041 | 1.00 | ACMSD (0.66) | ACMSDHNF4AMCL1DHFRKDM4E | |
| SCHEMBL30605782 | 1.00 | ACMSD (0.66) | ACMSDHNF4AMCL1DHFRKDM4E | |
| Benzene SCHEMBL3623695 | 0.93 | KMT2A (0.60) | ACMSDHNF4AMCL1DHFRKDM4E | |
| SCHEMBL28279304 | 0.91 | ACMSD (0.67) | ACMSDHNF4AMCL1DHFRKMO | |
| SCHEMBL30365332 | 0.91 | ACMSD (0.67) | ACMSDHNF4AMCL1DHFRKMO | |
| SCHEMBL68982 | 0.91 | ACMSD (0.70) | ACMSDHNF4AMCL1DHFRKDM4E | |
| SCHEMBL30616786 | 0.91 | ACMSD (0.70) | ACMSDHNF4AMCL1DHFRKDM4E | |
| SCHEMBL30690398 | 0.91 | KMT2A (0.62) | ACMSDHNF4AMCL1DHFRKDM4E | |
| SCHEMBL30690397 | 0.91 | KMT2A (0.62) | ACMSDHNF4AMCL1DHFRKDM4E |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 53 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119920908-A | Three-dimensional conductive adhesive, negative plate, secondary battery and preparation method | 孝感楚能新能源创新科技有限公司 | 2025-05-02 | — | — | CN | claimed |
| CN-118888968-A | Polyimide microporous diaphragm and preparation method thereof | 苏州泽世新能源科技有限公司 | 2024-11-01 | — | — | CN | claimed |
| CN-115627000-B | High-temperature-resistant polyimide diaphragm, preparation method thereof and application thereof in preparation of lithium ion battery | 天能新能源(湖州)有限公司 | 2023-11-10 | — | — | CN | claimed |
| CN-115636976-B | Polyimide diaphragm for lithium battery and preparation method thereof | 天能新能源(湖州)有限公司 | 2023-09-05 | — | — | CN | claimed |
| CN-116666894-A | Heat-resistant composite diaphragm and preparation method thereof | 天能电池集团股份有限公司 | 2023-08-29 | — | — | CN | claimed |
| CN-120134737-A | Resin sheet with metal foil | 味之素株式会社 | 2025-06-13 | — | — | CN | disclosed |
| CN-120134736-A | Resin sheet with metal foil | 味之素株式会社 | 2025-06-13 | — | — | CN | disclosed |
| CN-112210211-B | Resin composition | 味之素株式会社 | 2025-06-03 | — | — | CN | disclosed |
| CN-119920908-A | Three-dimensional conductive adhesive, negative plate, secondary battery and preparation method | 孝感楚能新能源创新科技有限公司 | 2025-05-02 | — | — | CN | disclosed |
| CN-118139906-B | Phenol resin, epoxy resin, curable resin composition, and cured product thereof | 日本化药株式会社 | 2025-02-25 | — | — | CN | disclosed |
| CN-111748206-B | Resin composition, cured product of resin composition, resin sheet, printed wiring board, and semiconductor device | 味之素株式会社 | 2025-02-07 | — | — | CN | disclosed |
| CN-111748175-B | Resin composition | 味之素株式会社 | 2024-11-22 | — | — | CN | disclosed |
| CN-112585228-B | Polyimide varnish for coating conductor containing aromatic carboxylic acid and method for producing same | PI尖端素材株式会社 | 2022-07-08 | — | — | CN | disclosed |
| CN-114650979-A | Compound, mixture, curable resin composition, cured product thereof, and method for producing compound | 日本化药株式会社 | 2022-06-21 | — | — | CN | disclosed |
| CN-114058324-B | Thermosetting resin composition and use thereof | 东洋油墨SC控股株式会社 | 2022-06-17 | — | — | CN | disclosed |
| CN-114381120-A | Resin composition | 味之素株式会社 | 2022-04-22 | — | — | CN | disclosed |
| CN-114174422-A | Resin composition, semiconductor sealing material using same, and dipping base material, circuit board, build-up film, prepreg, carbon fiber composite material, solder resist, dry film, and printed wiring board | DIC株式会社 | 2022-03-11 | — | — | CN | disclosed |
| CN-114133359-A | Diamine compound, method for preparing the same, and composition comprising the same | SK新技术株式会社 | 2022-03-04 | — | — | CN | disclosed |
| CN-114133563-A | Polyimide precursor, polyimide precursor composition, polyimide film, method for producing same, and use thereof | SK新技术株式会社 | 2022-03-04 | — | — | CN | disclosed |
| CN-114058324-A | Thermosetting resin composition and use thereof | 东洋油墨SC控股株式会社 | 2022-02-18 | — | — | CN | disclosed |