⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4365967 | 0.80 | DAO (0.34) | — | |
| SCHEMBL752841 | 0.79 | HDAC4 (0.30) | — | |
| SCHEMBL9722888 | 0.77 | STAT3 (0.31) | — | |
| SCHEMBL17924957 | 0.77 | — | — | |
| SCHEMBL17924920 | 0.77 | — | — | |
| SCHEMBL17924942 | 0.76 | HCAR2 (0.32) | — | |
| SCHEMBL9562487 | 0.76 | — | — | |
| SCHEMBL17924867 | 0.76 | KDM4E (0.34) | — | |
| SCHEMBL17924897 | 0.74 | — | — | |
| SCHEMBL29575986 | 0.74 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118355077-A | Resin composition, laminate, prepreg, cured product, substrate with cured product, and electronic device | 爱天思株式会社 | 2024-07-16 | — | — | CN | disclosed |
| CN-118222091-A | Resin composition, laminate, prepreg, cured product, substrate with cured product, and electronic device | 爱天思株式会社 | 2024-06-21 | — | — | CN | disclosed |
| CN-114058324-B | Thermosetting resin composition and use thereof | 东洋油墨SC控股株式会社 | 2022-06-17 | — | — | CN | disclosed |
| CN-114058324-A | Thermosetting resin composition and use thereof | 东洋油墨SC控股株式会社 | 2022-02-18 | — | — | CN | disclosed |