Predicted protein targets (top 10)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KIF11 | P52732 | 1/20 | 0.44 |
| ▸ | AR | P10275 | 13/20 | 0.42 |
| ▸ | TRPV4 | Q9HBA0 | 1/20 | 0.42 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.38 |
| ▸ | CYP2A6 | P11509 | 1/20 | 0.38 |
| ▸ | IMPDH2 | P12268 | 1/20 | 0.37 |
| ▸ | IMPDH1 | P20839 | 1/20 | 0.37 |
| ▸ | PGR | P06401 | 1/20 | 0.37 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.36 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8852317 | 1.00 | KIF11 (0.44) | KIF11ARTRPV4ALDH1A1CYP2A6 | |
| SCHEMBL13322370 | 0.84 | AR (0.40) | KIF11ARTRPV4ALDH1A1CYP2A6 | |
| SCHEMBL11724576 | 0.83 | KIF11 (0.44) | KIF11ARTRPV4ALDH1A1CYP2A6 | |
| SCHEMBL23873019 | 0.83 | KIF11 (0.47) | KIF11TRPV4ALDH1A1CYP2A6IMPDH2 | |
| SCHEMBL2154684 | 0.81 | KIF11 (0.45) | KIF11ARTRPV4ALDH1A1CYP2A6 | |
| SCHEMBL22349700 | 0.81 | AR (0.57) | AR | |
| SCHEMBL24617494 | 0.80 | KIF11 (0.38) | KIF11ARTRPV4ALDH1A1CYP2A6 | |
| SCHEMBL10256329 | 0.79 | AR (0.51) | ARALDH1A1CYP2A6 | |
| SCHEMBL20780709 | 0.79 | AR (0.49) | KIF11ARALDH1A1 | |
| SCHEMBL1003776 | 0.79 | AR (0.58) | ARTRPV4PGR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118574903-A | High performance thermosetting resins for 3D printing | 诺佳3D创新有限公司 | 2024-08-30 | — | — | CN | claimed |
| CN-120092029-A | Resin composition, cured product, prepreg, metal foil-clad laminate, resin composite sheet, and printed wiring board | 三菱瓦斯化学株式会社 | 2025-06-03 | — | — | CN | disclosed |
| CN-118574903-A | High performance thermosetting resins for 3D printing | 诺佳3D创新有限公司 | 2024-08-30 | — | — | CN | disclosed |
| CN-114787120-B | Compound and method for producing same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2024-08-09 | — | — | CN | disclosed |
| CN-118251445-A | Cyclic organosiloxane containing imide bond and polymerizable unsaturated bond and curable resin composition containing the same | 信越化学工业株式会社 | 2024-06-25 | — | — | CN | disclosed |
| CN-112204076-B | Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board | 三菱瓦斯化学株式会社 | 2023-10-24 | — | — | CN | disclosed |
| CN-116813824-A | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2023-09-29 | — | — | CN | disclosed |
| CN-113348079-B | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2023-06-02 | — | — | CN | disclosed |
| CN-112955302-B | Method for manufacturing a laminate with partial curing | 斯特拉塔西斯公司 | 2023-05-02 | — | — | CN | disclosed |
| CN-112204105-B | Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board | 三菱瓦斯化学株式会社 | 2023-04-14 | — | — | CN | disclosed |
| CN-115943062-A | Dual cure additive manufacturing resin for producing flame retardant objects | 卡本有限公司 | 2023-04-07 | — | — | CN | disclosed |
| CN-112930257-B | Three-dimensional inkjet printing of thermally stable objects | 斯特拉塔西斯公司 | 2023-03-24 | — | — | CN | disclosed |
| CN-109563287-B | Benzothiazoles as latent catalysts for benzoxazine resins | 亨斯迈先进材料美国有限责任公司 | 2022-09-09 | — | — | CN | disclosed |
| CN-115003716-A | Resin composition, resin sheet, prepreg, and printed wiring board | 三菱瓦斯化学株式会社 | 2022-09-02 | — | — | CN | disclosed |
| CN-110869410-B | Resin composition for printed wiring board, prepreg, resin sheet, laminate, metal foil-clad laminate, printed wiring board, and multilayer printed wiring board | 三菱瓦斯化学株式会社 | 2022-04-26 | — | — | CN | disclosed |
| CN-114106511-A | Power module manufacturing method and power module | 信越化学工业株式会社 | 2022-03-01 | — | — | CN | disclosed |