Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | PTPN1 | P18031 | 1/20 | 0.66 |
| ▸ | HSD17B10 | Q99714 | 3/20 | 0.59 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.59 |
| ▸ | ATIC | P31939 | 1/20 | 0.59 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.59 |
| ▸ | CDC25B | P30305 | 5/20 | 0.49 |
| ▸ | CDC25A | P30304 | 1/20 | 0.49 |
| ▸ | CDC25C | P30307 | 1/20 | 0.49 |
| ▸ | MEN1 | O00255 | 1/20 | 0.48 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.48 |
| ▸ | F2 | P00734 | 1/20 | 0.47 |
| ▸ | PLG | P00747 | 1/20 | 0.47 |
| ▸ | PLAU | P00749 | 1/20 | 0.47 |
| ▸ | PLAT | P00750 | 1/20 | 0.47 |
| ▸ | KLK1 | P06870 | 1/20 | 0.47 |
| ▸ | PRSS1 | P07477 | 1/20 | 0.47 |
| ▸ | CA12 | O43570 | 1/20 | 0.47 |
| ▸ | CA1 | P00915 | 1/20 | 0.47 |
| ▸ | CA2 | P00918 | 1/20 | 0.47 |
| ▸ | CA6 | P23280 | 1/20 | 0.47 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL341301 | 1.00 | PTPN1 (0.66) | PTPN1HSD17B10CYP2C9ATICCYP2C19 | |
| SCHEMBL6869446 | 0.86 | PTPN1 (0.54) | PTPN1HSD17B10CYP2C9ATICCYP2C19 | |
| SCHEMBL689325 | 0.85 | PLAU (0.66) | PTPN1HSD17B10CYP2C9ATICCYP2C19 | |
| SCHEMBL30791056 | 0.85 | PLAU (0.66) | PTPN1HSD17B10CYP2C9ATICCYP2C19 | |
| Isophthalic Acid SCHEMBL27522273 | 0.84 | HSD17B10 (0.61) | PTPN1HSD17B10CYP2C9ATICCYP2C19 | |
| SCHEMBL31061825 | 0.81 | PTPN1 (0.50) | PTPN1HSD17B10CYP2C9ATICCYP2C19 | |
| SCHEMBL31357157 | 0.81 | PTPN1 (0.70) | PTPN1HSD17B10CYP2C19MEN1KMT2A | |
| SCHEMBL2927283 | 0.80 | LCK (0.56) | HSD17B10CYP2C9ATICCYP2C19PLAU | |
| 3-Aminobenzoic Acid SCHEMBL8003488 | 0.80 | HSD17B10 (0.55) | HSD17B10CYP2C9ATICCYP2C19CDC25B | |
| SCHEMBL186327 | 0.79 | PTPN1 (0.68) | PTPN1CDC25BMEN1KMT2APLAU |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 37 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4573154-A1 | USE OF ADDITIVES FOR IMPROVING THE PROCESSING OF POLYETHYLENES | BASF SE (DE) | 2025-06-25 | — | — | EP | disclosed |
| WO-2025021592-A1 | RECYCLING OF POLYOLEFIN WASTE BY ADDING A AMIDE CLARIFIER | BASF SE (DE) | 2025-01-30 | — | — | WO | disclosed |
| WO-2024053655-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2024-03-14 | — | — | WO | disclosed |
| WO-2024048435-A1 | RESIN COMPOSITION, CURED ARTICLE, LAMINATE, METHOD FOR PRODUCING CURED ARTICLE, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2024-03-07 | — | — | WO | disclosed |
| WO-2024048604-A1 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2024-03-07 | — | — | WO | disclosed |
| WO-2024048605-A1 | RESIN COMPOSITION, CURED PRODUCT, LAYERED BODY, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAYERED BODY, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2024-03-07 | — | — | WO | disclosed |
| WO-2024048603-A1 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2024-03-07 | — | — | WO | disclosed |
| WO-2024048436-A1 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2024-03-07 | — | — | WO | disclosed |
| WO-2024024833-A1 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, CURED PRODUCT MANUFACTURING METHOD, LAMINATE MANUFACTURING METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SEMICONDUCTOR DEVICE, RESIN FILM, AND COMPOUND | 富士フイルム株式会社 | 2024-02-01 | — | — | WO | disclosed |
| WO-2023243613-A1 | COMPOSITION, THERMALLY CONDUCTIVE MATERIAL, DEVICE, AND PRODUCTION METHOD FOR MODIFIED INORGANIC PARTICLES | 富士フイルム株式会社 | 2023-12-21 | — | — | WO | disclosed |
| WO-2022064933-A1 | METHOD FOR PRODUCING COMPOSITE PATTERN, RESIN COMPOSITION, METHOD FOR PRODUCING MULTILAYER BODY, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2022-03-31 | — | — | WO | disclosed |
| WO-2022059621-A1 | RESIN COMPOSITION, CURED OBJECT, LAYERED PRODUCT, METHOD FOR PRODUCING CURED OBJECT, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2022-03-24 | — | — | WO | disclosed |
| WO-2022059622-A1 | RESIN COMPOSITION, CURED OBJECT, LAYERED PRODUCT, METHOD FOR PRODUCING CURED OBJECT, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2022-03-24 | — | — | WO | disclosed |
| WO-2022050041-A1 | CURED PRODUCT PRODUCTION METHOD, LAMINATE PRODUCTION METHOD, AND ELECTRONIC DEVICE PRODUCTION METHOD | 富士フイルム株式会社 | 2022-03-10 | — | — | WO | disclosed |
| WO-2022050135-A1 | CURED PRODUCT PRODUCTION METHOD, LAMINATE PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE PRODUCTION METHOD | 富士フイルム株式会社 | 2022-03-10 | — | — | WO | disclosed |
| WO-2022050278-A1 | CURABLE RESIN COMPOSITION, CURED OBJECT, LAYERED PRODUCT, METHOD FOR PRODUCING CURED OBJECT, SEMICONDUCTOR DEVICE, AND PHOTOBASE GENERATOR | 富士フイルム株式会社 | 2022-03-10 | — | — | WO | disclosed |
| WO-2022045124-A1 | CURABLE RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2022-03-03 | — | — | WO | disclosed |
| WO-2022045059-A1 | RESIN COMPOSITION, CURED PRODUCT, MULTILAYER BODY, METHOD FOR PRODUCING CURED PRODUCT, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2022-03-03 | — | — | WO | disclosed |
| WO-2022045120-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR MANUFACTURING CURED PRODUCT, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2022-03-03 | — | — | WO | disclosed |
| WO-2022045060-A1 | CURABLE RESIN COMPOSITION, CURED PRODUCT, MULTILAYER BODY, METHOD FOR PRODUCING CURED PRODUCT, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2022-03-03 | — | — | WO | disclosed |