SCHEMBL341301

SCHEMBL341301

Nc1cccc2cc(C(=O)O)ccc12

nearest known ligand 0.66

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PTPN1 P18031 1/20 0.66
HSD17B10 Q99714 3/20 0.59
CYP2C9 P11712 1/20 0.59
ATIC P31939 1/20 0.59
CYP2C19 P33261 1/20 0.59
CDC25B P30305 5/20 0.49
CDC25A P30304 1/20 0.49
CDC25C P30307 1/20 0.49
MEN1 O00255 1/20 0.48
KMT2A Q03164 1/20 0.48
F2 P00734 1/20 0.47
PLG P00747 1/20 0.47
PLAU P00749 1/20 0.47
PLAT P00750 1/20 0.47
KLK1 P06870 1/20 0.47
PRSS1 P07477 1/20 0.47
CA12 O43570 1/20 0.47
CA1 P00915 1/20 0.47
CA2 P00918 1/20 0.47
CA6 P23280 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29397498 1.00 PTPN1 (0.66) PTPN1HSD17B10CYP2C9ATICCYP2C19
SCHEMBL6869446 0.86 PTPN1 (0.54) PTPN1HSD17B10CYP2C9ATICCYP2C19
SCHEMBL689325 0.85 PLAU (0.66) PTPN1HSD17B10CYP2C9ATICCYP2C19
SCHEMBL30791056 0.85 PLAU (0.66) PTPN1HSD17B10CYP2C9ATICCYP2C19
Isophthalic Acid SCHEMBL27522273 0.84 HSD17B10 (0.61) PTPN1HSD17B10CYP2C9ATICCYP2C19
SCHEMBL31061825 0.81 PTPN1 (0.50) PTPN1HSD17B10CYP2C9ATICCYP2C19
SCHEMBL31357157 0.81 PTPN1 (0.70) PTPN1HSD17B10CYP2C19MEN1KMT2A
SCHEMBL2927283 0.80 LCK (0.56) HSD17B10CYP2C9ATICCYP2C19PLAU
3-Aminobenzoic Acid SCHEMBL8003488 0.80 HSD17B10 (0.55) HSD17B10CYP2C9ATICCYP2C19CDC25B
SCHEMBL186327 0.79 PTPN1 (0.68) PTPN1CDC25BMEN1KMT2APLAU

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 680 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119781246-A Photosensitive polyimide resin composition, cured film, and preparation method and application thereof 吉林奥来德光电材料股份有限公司 2025-04-08 CN claimed
CN-115010924-A Photosensitive polyimide resin composition, polyimide resin film containing same and application of polyimide resin film 吉林奥来德光电材料股份有限公司 2022-09-06 CN claimed
EP-1630605-B1 PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES (JP) 2017-10-11 EP claimed
CN-102863822-A Hyperbranched macromolecule dispersing agent for dispersing dyes and preparation method thereof UNIV SHAANXI SCIENCE & TECH 2013-01-09 CN claimed
WO-2026100508-A1 RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND RESIN 富士フイルム株式会社 2026-05-15 WO disclosed
CN-122029489-A Photosensitive resin composition, cured product, display device, and electronic component 东丽株式会社 2026-05-12 CN disclosed
EP-4738010-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION COATING FILM, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION FILM, CURED FILM, AND ELECTRONIC COMPONENT COMPRISING SAME Toray Industries, Inc. (JP) 2026-05-06 EP disclosed
EP-3893054-B1 PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE FUJIFILM CORP (JP) 2026-05-06 EP disclosed
US-20260104641-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-04-16 US disclosed
US-12583973-B2 Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-03-24 US disclosed
EP-4692937-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT AND METHOD FOR PRODUCING SAME, HOLLOW STRUCTURE, ELECTRONIC COMPONENT, AND ELASTIC WAVE FILTER Toray Industries, Inc. (JP) 2026-02-11 EP disclosed
US-20260003276-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2026-01-01 US disclosed
WO-1992013037-A1 ANIONIC DISAZO DYES IMPERIAL CHEMICAL INDUSTRIES PLC (GB) 1992-08-06 WO disclosed
EP-0480705-A1 Monoazo lake pigment, process for producing the same and its use TOYO INK MANUFACTURING CO., LTD. (JP) 1992-04-15 EP disclosed
US-5053495-A For thermal ink jet printing IMPERIAL CHEMICAL INDUSTRIES PLC (GB) 1991-10-01 US disclosed
CN-1046528-A As the new naphthalane base-3H-1 of antihyperglycemic agents, 2,3,5-oxygen thia diazole 2-oxide compound AMERICAN HOME PROD (US) 1990-10-31 CN disclosed
US-4966975-A Processes for the preparation of novel naphthalenylmethyl-3H-1,2,3,5-oxathiadiazole 2-oxides useful as antihyperglycemic agents AMERICAN HOME PRODUCT 1990-10-30 US disclosed
EP-0393941-A1 Naphthalene derivatives AMERICAN HOME PRODUCTS CORPORATION (US) 1990-10-24 EP disclosed
EP-0356080-A2 Anionic dye ZENECA LIMITED (GB) 1990-02-28 EP disclosed
US-4897405-A Novel naphthalenylalkyl-3H-1,2,3,5-oxathiadiazole 2-oxides useful as antihyperglycemic agents AMERICAN HOME PRODUCTS CORPORATION (US) 1990-01-30 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260104641-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT ARCN1, PRDM9, LBR PTPN1 2077/4885HSD17B10 4284/4885CYP2C9 2081/4885
US-20260003276-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE RER1, SEM1, RAD51 PTPN1 2284/4885HSD17B10 3559/4885CYP2C9 1493/4885
US-12583973-B2 Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component PRDM9, ARCN1, PUF60 PTPN1 923/4885HSD17B10 4119/4885CYP2C9 3892/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.