SCHEMBL29401448

SCHEMBL29401448

Oc1ccc(C2(c3ccc(O)c(C4CCCCC4)c3)CCCCC2)cc1C1CCCCC1

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 4/20 0.56
ESR2 Q92731 4/20 0.56
HSP90AA1 P07900 1/20 0.53
NUDT1 P36639 1/20 0.49
BACE1 P56817 1/20 0.49
ACHE P22303 1/20 0.40
ALDH1A1 P00352 2/20 0.39
L3MBTL1 Q9Y468 1/20 0.39
ACMSD Q8TDX5 2/20 0.37
THRB P10828 1/20 0.37
LMNA P02545 3/20 0.35
ALOX12 P18054 3/20 0.35
MAPT P10636 2/20 0.33
NPSR1 Q6W5P4 1/20 0.33
HTT P42858 1/20 0.33
MEN1 O00255 2/20 0.33
KMT2A Q03164 2/20 0.33
KDM4E B2RXH2 1/20 0.33
HDAC4 P56524 1/20 0.33
HDAC2 Q92769 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3021025 1.00 ESR1 (0.56) ESR1ESR2HSP90AA1NUDT1BACE1
SCHEMBL10595392 1.00 ESR1 (0.56) ESR1ESR2HSP90AA1NUDT1BACE1
SCHEMBL5881414 1.00 ESR1 (0.56) ESR1ESR2HSP90AA1NUDT1BACE1
SCHEMBL20225257 1.00 ESR1 (0.56) ESR1ESR2HSP90AA1NUDT1BACE1
SCHEMBL278620 1.00 ESR1 (0.56) ESR1ESR2HSP90AA1NUDT1BACE1
SCHEMBL9008331 1.00 ESR1 (0.56) ESR1ESR2HSP90AA1NUDT1BACE1
SCHEMBL10941119 0.94 ESR2 (0.59) ESR1ESR2HSP90AA1NUDT1BACE1
SCHEMBL278720 0.89 ESR1 (0.47) ESR1ESR2HSP90AA1NUDT1BACE1
SCHEMBL28105861 0.87 HSP90AA1 (0.45) ESR1ESR2HSP90AA1NUDT1BACE1
SCHEMBL29108770 0.86 HSP90AA1 (0.44) ESR1ESR2HSP90AA1NUDT1BACE1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119816558-A Polycarbonate resin composition and molded article comprising the same 帝人株式会社 2025-04-11 CN disclosed
US-20240400247-A1 TEMPERATURE INDICATOR MANUFACTURING SYSTEM AND TEMPERATURE INDICATOR MANUFACTURING METHOD HITACHI INDUSTRIAL EQUIPMENT SYSTEMS CO., LTD. (JP) 2024-12-05 US disclosed
WO-2024224788-A1 RESIN, COPOLYMER, ELECTRONIC SUBSTRATE MATERIAL, RESIN COMPOSITION, COATING LIQUID COMPOSITION, CURED PRODUCT, FILM, SHEET, AND ELECTRONIC SUBSTRATE 出光興産株式会社 2024-10-31 WO disclosed
EP-4431889-A1 TEMPERATURE INDICATOR MANUFACTURING SYSTEM AND TEMPERATURE INDICATOR MANUFACTURING METHOD Hitachi Industrial Equipment Systems Co., Ltd. (JP) 2024-09-18 EP disclosed
US-12085452-B2 Temperature detection ink, temperature detection ink initialization method, temperature indicator, and article management system HITACHI INDUSTRIAL EQUIPMENT SYSTEMS CO., LTD. (JP) 2024-09-10 US disclosed
CN-113449832-B Code, information processing system, and information processing apparatus 株式会社日立制作所 2024-06-04 CN disclosed
EP-3608116-B1 MARKING SYSTEM AND MARKING DEVICE HITACHI LTD (JP) 2024-05-08 EP disclosed
CN-117957283-A Resin composition and molded article thereof 帝人株式会社 2024-04-30 CN disclosed
CN-115926169-B Method for producing polysiloxane compound, composition, and molded article 三菱瓦斯化学株式会社 2024-03-22 CN disclosed
EP-3745106-B1 TEMPERATURE DETECTION INK, TEMPERATURE DETECTION INK INITIALIZATION METHOD, TEMPERATURE INDICATOR, AND ARTICLE MANAGEMENT SYSTEM HITACHI INDUSTRY EQUIPMENT SYSTEMS CO LTD (JP) 2023-10-25 EP disclosed
CN-113614144-B Method for producing polycarbonate copolymer and polysiloxane compound, polycarbonate copolymer, polysiloxane compound, composition, and molded article 三菱瓦斯化学株式会社 2023-03-28 CN disclosed
CN-111684013-B Thermoplastic resin composition and molded article thereof 帝人株式会社 2023-02-28 CN disclosed
CN-115698854-A Photosensitive resin composition, cured product, display device, semiconductor device, and method for producing cured product 东丽株式会社 2023-02-03 CN disclosed
WO-2023281602-A1 THERMOPLASTIC RESIN COMPOSITION, MOLDED ARTICLE AND PRODUCT 三菱電機株式会社 2023-01-12 WO disclosed
US-11443154-B2 Code, information processing system, and information processing device HITACHI, LTD. (JP) 2022-09-13 US disclosed
CN-107844036-B Electrophotographic photoreceptor, process cartridge, and image forming apparatus 富士胶片商业创新有限公司 2022-08-30 CN disclosed
CN-110869415-B Polycarbonate copolymer 帝人株式会社 2022-06-17 CN disclosed
WO-2022075328-A1 POLYCARBONATE RESIN COMPOSITION AND CIRCUIT MOLDED ARTICLE FOR COMMUNICATION DEVICES 帝人株式会社 2022-04-14 WO disclosed
WO-2022038883-A1 POLYCARBONATE-POLYSILOXANE RESIN 帝人株式会社 2022-02-24 WO disclosed
WO-2022039028-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, DISPLAY DEVICE, SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING CURED PRODUCT 東レ株式会社 2022-02-24 WO disclosed