SCHEMBL29404709

SCHEMBL29404709

O=C(c1ccc(C(=O)O)c(C(=O)O)c1)c1ccc(C(=O)O)c(C(=O)O)c1

nearest known ligand 0.80

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
POLB P06746 3/20 0.80
TDP1 Q9NUW8 3/20 0.80
L3MBTL1 Q9Y468 2/20 0.80
CDC25B P30305 2/20 0.76
CDC25A P30304 1/20 0.76
HSD17B10 Q99714 1/20 0.76
KDM4E B2RXH2 1/20 0.61
SRD5A2 P31213 5/20 0.52
ALDH1A1 P00352 3/20 0.50
AKR1C3 P42330 1/20 0.48
ALOX15 P16050 1/20 0.48
CYP1A2 P05177 1/20 0.48
ATM Q13315 2/20 0.47
APEX1 P27695 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL48886 1.00 POLB (0.80) POLBTDP1L3MBTL1CDC25BCDC25A
SCHEMBL30754379 0.98 TDP1 (0.84) POLBTDP1L3MBTL1CDC25BCDC25A
Hydrochloric Acid SCHEMBL338195 0.98 POLB (0.77) POLBTDP1L3MBTL1CDC25BCDC25A
SCHEMBL203260 0.98 TDP1 (0.84) POLBTDP1L3MBTL1CDC25BCDC25A
SCHEMBL7045921 0.98 TDP1 (0.84) POLBTDP1L3MBTL1CDC25BCDC25A
SCHEMBL268918 0.98 POLB (0.77) POLBTDP1L3MBTL1CDC25BCDC25A
SCHEMBL6693862 0.98 POLB (0.77) POLBTDP1L3MBTL1CDC25BCDC25A
SCHEMBL29440676 0.98 TDP1 (0.84) POLBTDP1L3MBTL1CDC25BCDC25A
Hydrochloric Acid SCHEMBL893971 0.98 POLB (0.77) POLBTDP1L3MBTL1CDC25BCDC25A
SCHEMBL6866245 0.93 POLB (0.78) POLBTDP1L3MBTL1CDC25BCDC25A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 128 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250313697-A1 BINDERS WITH IMPROVED CURE KINETICS AND THERMAL PERFORMANCE FOR FIBROUS MATERIALS JOHNS MANVILLE 2025-10-09 US claimed
US-20250023024-A1 NEGATIVE ELECTRODE MATERIAL, NEGATIVE ELECTRODE PLATE AND BATTERY ZHUHAI COSMX BATTERY CO., LTD. (CN) 2025-01-16 US claimed
CN-118307778-A Extrusion type polyimide material, preparation method and application thereof 上海三普水相材料科技有限公司 2024-07-09 CN claimed
CN-115768722-A Polyimide bead material and method for producing same 斯攀气凝胶公司 2023-03-07 CN claimed
CN-115720583-A Process for producing polyimide 维也纳科技大学 2023-02-28 CN claimed
CN-112694614-B Method for synthesizing polyimide in aqueous phase 浙江清和新材料科技有限公司 2023-01-24 CN claimed
CN-113896470-B Cement-based thin felt for composite board and production process thereof 安徽瑞联节能科技股份有限公司(CN) 2023-01-13 CN claimed
CN-111424419-B Hydrogen peroxide catalytic system containing benzophenone structure derivative and application of hydrogen peroxide catalytic system in low-temperature pretreatment of textiles 无锡浦惠恒业纺织科技有限公司 2022-11-04 CN claimed
CN-114920931-A Polyimide precursor composition, polyimide film, and method for producing same 中化学科学技术研究有限公司 2022-08-19 CN claimed
CN-114854011-A Polyamide acid solution, polyimide film and preparation method thereof 中化学科学技术研究有限公司 2022-08-05 CN claimed
CN-114605363-A Preparation method of 3,3',4,4' -benzophenone tetracarboxylic dianhydride 大连新阳光材料科技有限公司 2022-06-10 CN claimed
WO-2022069783-A1 BIODEGRADABLE BIOMATERIAL UNIVERSITAT POLITÈCNICA DE VALÈNCIA (ES) 2022-04-07 WO claimed
EP-4680375-A1 SYSTEM AND METHOD FOR FLUID CAPTURE GE Vernova Technology GmbH (CH) 2026-01-21 EP disclosed
EP-4680369-A1 SYSTEMS FOR CARBON DIOXIDE CAPTURE USING FUNCTIONALIZED SORBENTS AND WATER MANAGEMENT GE Vernova Technology GmbH (CH) 2026-01-21 EP disclosed
EP-4680252-A1 SYSTEM AND METHOD FOR FLUID CAPTURE GE Vernova Infrastructure Technology LLC (US) 2026-01-21 EP disclosed
EP-4676643-A2 POST-SYNTHETIC FUNCTIONALIZATION OF POROUS MATERIALS Mosaic Materials, Inc. (US) 2026-01-14 EP disclosed
WO-2022046645-A2 POLYIMIDE BEAD MATERIALS AND METHODS OF MANUFACTURE THEREOF ASPEN AEROGELS INC. (US) 2022-03-03 WO disclosed
WO-2022039028-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, DISPLAY DEVICE, SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING CURED PRODUCT 東レ株式会社 2022-02-24 WO disclosed
WO-2022034871-A1 COPPER FOIL WITH RESIN LAYER AND LAMINATE USING SAME 三菱瓦斯化学株式会社 2022-02-17 WO disclosed
WO-2022018994-A1 MULTILAYER BODY AND METHOD FOR PRODUCING FLEXIBLE DEVICE 東洋紡株式会社 2022-01-27 WO disclosed