Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP1A2 | P05177 | 2/20 | 0.50 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.50 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.50 |
| ▸ | GLRA3 | O75311 | 1/20 | 0.44 |
| ▸ | GLRB | P48167 | 1/20 | 0.44 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.41 |
| ▸ | CA2 | P00918 | 2/20 | 0.41 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.41 |
| ▸ | POLB | P06746 | 1/20 | 0.41 |
| ▸ | TYR | P14679 | 1/20 | 0.41 |
| ▸ | AKR1C3 | P42330 | 8/20 | 0.40 |
| ▸ | AKR1C2 | P52895 | 8/20 | 0.40 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.39 |
| ▸ | MEN1 | O00255 | 1/20 | 0.39 |
| ▸ | GALR3 | O60755 | 1/20 | 0.39 |
| ▸ | HTT | P42858 | 1/20 | 0.39 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.39 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.39 |
| ▸ | CA1 | P00915 | 1/20 | 0.38 |
| ▸ | GABRA1 | P14867 | 1/20 | 0.38 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL7108121 | 1.00 | CYP1A2 (0.50) | CYP1A2CYP2C9CYP2C19GLRA3GLRB | |
| SCHEMBL283603 | 1.00 | CYP1A2 (0.50) | CYP1A2CYP2C9CYP2C19GLRA3GLRB | |
| SCHEMBL38652043 | 0.98 | CYP1A2 (0.49) | CYP1A2CYP2C9CYP2C19GLRA3GLRB | |
| SCHEMBL27505107 | 0.93 | CYP1A2 (0.44) | CYP1A2CYP2C9CYP2C19GLRA3GLRB | |
| SCHEMBL11704980 | 0.90 | CYP2C9 (0.50) | CYP1A2CYP2C9CYP2C19GLRA3GLRB | |
| SCHEMBL100584 | 0.90 | GLRA3 (0.50) | CYP1A2GLRA3GLRBSMN1; SMN2CA2 | |
| SCHEMBL6275312 | 0.90 | GLRA3 (0.50) | CYP1A2GLRA3GLRBSMN1; SMN2CA2 | |
| Methane SCHEMBL4556718 | 0.88 | GLRA3 (0.48) | CYP1A2GLRA3GLRBSMN1; SMN2CA2 | |
| Hydrochloric Acid SCHEMBL1874072 | 0.88 | GLRA3 (0.48) | CYP1A2GLRA3GLRBSMN1; SMN2CA2 | |
| SCHEMBL38652274 | 0.88 | GLRA3 (0.48) | CYP1A2GLRA3GLRBSMN1; SMN2CA2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118727071-A | High Wen Dunie electroplating solution and preparation method thereof | 江门市优彼思半导体材料有限公司 | 2024-10-01 | — | — | CN | claimed |
| CN-115536904-A | Size-sensitive polymer functional additive and preparation method thereof | 北京化工大学 | 2022-12-30 | — | — | CN | claimed |
| CN-118984855-A | Resin composition and hot melt adhesive composition | 东洋纺艾睦希株式会社 | 2024-11-19 | — | — | CN | disclosed |
| CN-118727071-A | High Wen Dunie electroplating solution and preparation method thereof | 江门市优彼思半导体材料有限公司 | 2024-10-01 | — | — | CN | disclosed |
| WO-2024024842-A1 | LAMINATE MANUFACTURING METHOD | 富士フイルム株式会社 | 2024-02-01 | — | — | WO | disclosed |
| CN-113831881-B | Epoxy resin adhesive for microporous permeable material and microporous permeable material | 天阳新材料(内蒙古)有限公司 | 2024-01-23 | — | — | CN | disclosed |
| CN-113652189-B | Sealing resin composition | 东洋纺MC株式会社 | 2023-12-01 | — | — | CN | disclosed |
| US-20230324793-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND CURED PRODUCT | ECHEM SOLUTIONS CORP. (TW) | 2023-10-12 | — | — | US | disclosed |
| US-20230323134-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND CURED PRODUCT | ECHEM SOLUTIONS CORP. (TW) | 2023-10-12 | — | — | US | disclosed |
| CN-115536904-A | Size-sensitive polymer functional additive and preparation method thereof | 北京化工大学 | 2022-12-30 | — | — | CN | disclosed |
| CN-110121533-B | Polyester resin composition, adhesive, and laminate | 尤尼吉可株式会社 | 2022-06-21 | — | — | CN | disclosed |
| WO-2022095384-A1 | POLYOXYMETHYLENE COMPOSITION HAVING HIGH GLOW WIRE FLAMMABILITY INDEX, PREPARATION METHOD THEREFOR AND USE THEREOF | 金发科技股份有限公司 | 2022-05-12 | — | — | WO | disclosed |
| WO-2022095383-A1 | POLYOXYMETHYLENE COMPOSITION HAVING HIGH PERFORMANCE AND HIGH GLOW WIRE FLAMMABILITY INDEX, PREPARATION METHOD THEREFOR AND USE THEREOF | 金发科技股份有限公司 | 2022-05-12 | — | — | WO | disclosed |
| WO-2022059417-A1 | PHOTOSENSITIVE TRANSFER MATERIAL, METHOD FOR PRODUCING RESIN PATTERN, METHOD FOR PRODUCING CIRCUIT WIRING, AND METHOD FOR PRODUCING TOUCH PANEL | 富士フイルム株式会社 | 2022-03-24 | — | — | WO | disclosed |
| CN-112852527-B | High-thermal-stability sealing grease and preparation method thereof | 北京市政建设集团有限责任公司 | 2022-03-22 | — | — | CN | disclosed |
| WO-2022054599-A1 | PHOTOSENSITIVE TRANSFER MATERIAL, METHOD FOR PRODUCING RESIN PATTERN, ETCHING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE | 富士フイルム株式会社 | 2022-03-17 | — | — | WO | disclosed |
| WO-2022041591-A1 | POLYOXYMETHYLENE COMPOSITION, PREPARATION METHOD THEREFOR AND USE THEREOF | 金发科技股份有限公司 | 2022-03-03 | — | — | WO | disclosed |