Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | SLC9A1 | P19634 | 8/20 | 0.58 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.55 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.55 |
| ▸ | GRM2 | Q14416 | 2/20 | 0.54 |
| ▸ | TSHR | P16473 | 2/20 | 0.54 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.54 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.54 |
| ▸ | LMNA | P02545 | 1/20 | 0.54 |
| ▸ | TP53 | P04637 | 1/20 | 0.54 |
| ▸ | HPGD | P15428 | 1/20 | 0.54 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.54 |
| ▸ | EGLN3 | Q9H6Z9 | 1/20 | 0.53 |
| ▸ | RAB9A | P51151 | 2/20 | 0.51 |
| ▸ | NPC1 | O15118 | 1/20 | 0.51 |
| ▸ | MAPT | P10636 | 1/20 | 0.51 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.50 |
| ▸ | GLA | P06280 | 1/20 | 0.50 |
| ▸ | KCNMA1 | Q12791 | 1/20 | 0.49 |
| ▸ | MGAM | O43451 | 1/20 | 0.47 |
| ▸ | AMY1A | P0DUB6 | 1/20 | 0.47 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL869925 | 1.00 | SLC9A1 (0.58) | SLC9A1CYP1A2CYP2C19GRM2TSHR | |
| SCHEMBL31234269 | 0.85 | SLC9A1 (0.70) | SLC9A1GRM2TSHRCYP2D6HPGD | |
| SCHEMBL1774497 | 0.85 | SLC9A1 (0.70) | SLC9A1GRM2TSHRCYP2D6HPGD | |
| SCHEMBL18977498 | 0.78 | SLC9A1 (0.68) | SLC9A1GRM2TSHRALDH1A1LMNA | |
| SCHEMBL6125436 | 0.77 | SLC9A1 (0.66) | SLC9A1GRM2TSHRCYP2D6HPGD | |
| SCHEMBL9137840 | 0.76 | CYP2D6 (0.79) | SLC9A1CYP2C19GRM2TSHRCYP2D6 | |
| SCHEMBL9341979 | 0.76 | SLC9A1 (0.63) | SLC9A1GRM2TSHRCYP2D6EGLN3 | |
| SCHEMBL4340679 | 0.74 | CYP2D6 (0.74) | SLC9A1CYP2C19GRM2TSHRCYP2D6 | |
| SCHEMBL5134759 | 0.73 | CYP1A2 (1.00) | CYP1A2CYP2C19ALDH1A1HPGDKMT2A | |
| SCHEMBL2794079 | 0.73 | SLC9A1 (0.66) | SLC9A1GRM2TSHRCYP2D6HPGD |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-122029306-A | Method for producing conductive particles and conductive powder | 日本化学工业株式会社 | 2026-05-12 | — | — | CN | disclosed |
| CN-120202515-A | Conductive particle, method for producing same, conductive material, and connection structure using same | 日本化学工业株式会社 | 2025-06-24 | — | — | CN | disclosed |
| CN-119768874-A | Conductive particle, method for producing same, and conductive material | 日本化学工业株式会社 | 2025-04-04 | — | — | CN | disclosed |
| CN-115667579-B | Method for producing conductive particles, and conductive particles | 日本化学工业株式会社 | 2025-03-25 | — | — | CN | disclosed |
| CN-119631160-A | Stripping agent composition for light irradiation stripping, laminate, and method for producing processed semiconductor substrate | 日产化学株式会社 | 2025-03-14 | — | — | CN | disclosed |
| CN-115667578-B | Conductive particle, conductive material using same, and connection structure | 日本化学工业株式会社 | 2025-01-28 | — | — | CN | disclosed |
| CN-118507421-A | Laminate containing novolac resin as release layer | 日产化学株式会社 | 2024-08-16 | — | — | CN | disclosed |
| CN-111316401-B | Laminate containing novolac resin as release layer | 日产化学株式会社 | 2024-08-02 | — | — | CN | disclosed |
| CN-117882172-A | Adhesive composition, laminate, and method for producing processed semiconductor substrate | 日产化学株式会社 | 2024-04-12 | — | — | CN | disclosed |
| CN-109075060-B | Method for manufacturing semiconductor substrate having group III nitride compound layer | 日产化学株式会社 | 2024-03-29 | — | — | CN | disclosed |
| CN-116997861-A | Composition for forming resist underlayer film | 日产化学株式会社 | 2023-11-03 | — | — | CN | disclosed |
| CN-116635442-A | Composition for forming resist underlayer film | 日产化学株式会社 | 2023-08-22 | — | — | CN | disclosed |
| CN-116235112-A | Composition for forming resist underlayer film comprising fluoroalkyl group-containing organic acid or salt thereof | 日产化学株式会社 | 2023-06-06 | — | — | CN | disclosed |
| CN-116157898-A | Laminate, stripper composition, and method for producing processed semiconductor substrate | 日产化学株式会社 | 2023-05-23 | — | — | CN | disclosed |
| CN-116149141-A | Method for producing resin pattern, method for producing conductive pattern, and laminate | 富士胶片株式会社 | 2023-05-23 | — | — | CN | disclosed |
| CN-116149134-A | Method for producing resin pattern, method for producing conductive pattern, and laminate | 富士胶片株式会社 | 2023-05-23 | — | — | CN | disclosed |
| CN-116149136-A | Photosensitive composition, laminate, pattern forming method, and patterned laminate | 富士胶片株式会社 | 2023-05-23 | — | — | CN | disclosed |
| WO-2022138454-A1 | RESIST UNDERLAYER FILM FORMATION COMPOSITION | 日産化学株式会社 | 2022-06-30 | — | — | WO | disclosed |
| CN-112004845-B | Resin composition, laminate, semiconductor wafer with resin composition layer, substrate, and semiconductor device | 三菱瓦斯化学株式会社 | 2022-05-31 | — | — | CN | disclosed |
| WO-2022065374-A1 | RESIST UNDERLAYER FILM-FORMING COMPOSITION COMPRISING FLUOROALKYL GROUP-CONTAINING ORGANIC ACID OR SALT THEREOF | 日産化学株式会社 | 2022-03-31 | — | — | WO | disclosed |