2,3-Pentanedione

2,3-Pentanedione

SCHEMBL29438255

CCC(=O)C(C)=O.CCC(=O)C(C)=O.[Ti]

nearest known ligand 0.50

Full drug profile on Sugi Atlas →

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.50
TDP1 Q9NUW8 2/20 0.50
CES1 P23141 4/20 0.48
CA4 P22748 2/20 0.41
FFAR3 O14843 2/20 0.41
TSHR P16473 2/20 0.40
THPO P40225 1/20 0.40
CA1 P00915 2/20 0.38
CES2 O00748 3/20 0.37
LMNA P02545 2/20 0.33
HDAC3 O15379 1/20 0.33
HDAC1 Q13547 1/20 0.33
HDAC2 Q92769 1/20 0.33
HDAC8 Q9BY41 1/20 0.33
HSD17B10 Q99714 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
2,3-Pentanedione SCHEMBL27496063 1.00
2,3-Pentanedione SCHEMBL28033162 1.00
2,3-Pentanedione SCHEMBL1514922 0.96 ALDH1A1 (0.53) ALDH1A1TDP1CES1CA4FFAR3
2,3-Pentanedione SCHEMBL106990 0.96
2,3-Pentanedione SCHEMBL8677138 0.96
2,3-Pentanedione SCHEMBL473662 0.93 ALDH1A1 (0.50) ALDH1A1TDP1CES1CA4FFAR3
2,3-Pentanedione SCHEMBL15608522 0.93 ALDH1A1 (0.50) ALDH1A1TDP1CES1CA4FFAR3
2,3-Pentanedione SCHEMBL8124624 0.93
2,3-Pentanedione SCHEMBL30534889 0.93
2,3-Pentanedione SCHEMBL2789914 0.93

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118938601-A Negative photosensitive resin composition and method for producing cured relief pattern 旭化成株式会社 2024-11-12 CN disclosed
CN-118838117-A Polyimide cured film 旭化成株式会社 2024-10-25 CN disclosed
CN-114249912-B Method for producing polyimide cured film 旭化成株式会社 2024-09-03 CN disclosed
CN-116868124-A Photosensitive resin composition, method for producing polyimide cured film using same, and polyimide cured film 旭化成株式会社 2023-10-10 CN disclosed
CN-116802560-A Photosensitive resin composition, method for producing polyimide cured film using same, and polyimide cured film 旭化成株式会社 2023-09-22 CN disclosed
CN-116609998-A Polyimide precursor, negative photosensitive resin composition, and method for producing cured relief pattern using same 旭化成株式会社 2023-08-18 CN disclosed
CN-115039029-A Negative photosensitive resin composition and method for producing cured relief pattern 旭化成株式会社 2022-09-09 CN disclosed
CN-114249912-A Method for producing polyimide cured film 旭化成株式会社 2022-03-29 CN disclosed