Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MEN1 | O00255 | 2/20 | 0.36 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.36 |
| ▸ | S100A4 | P26447 | 2/20 | 0.36 |
| ▸ | MAOA | P21397 | 2/20 | 0.36 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.36 |
| ▸ | CES2 | O00748 | 1/20 | 0.36 |
| ▸ | APAF1 | O14727 | 1/20 | 0.36 |
| ▸ | TERT | O14746 | 1/20 | 0.36 |
| ▸ | NPC1 | O15118 | 1/20 | 0.36 |
| ▸ | PLIN1 | O60240 | 1/20 | 0.36 |
| ▸ | TDP2 | O95551 | 1/20 | 0.36 |
| ▸ | S1PR4 | O95977 | 1/20 | 0.36 |
| ▸ | LMNA | P02545 | 1/20 | 0.36 |
| ▸ | PLA2G1B | P04054 | 1/20 | 0.36 |
| ▸ | BCHE | P06276 | 1/20 | 0.36 |
| ▸ | POLB | P06746 | 1/20 | 0.36 |
| ▸ | PTPRC | P08575 | 1/20 | 0.36 |
| ▸ | MAPT | P10636 | 1/20 | 0.36 |
| ▸ | THRB | P10828 | 1/20 | 0.36 |
| ▸ | PLCG1 | P19174 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL18343556 | 0.87 | MEN1 (0.36) | MEN1KMT2AS100A4MAOAKDM4E | |
| SCHEMBL14139282 | 0.87 | MEN1 (0.41) | MEN1KMT2AS100A4MAOAKDM4E | |
| SCHEMBL12433902 | 0.85 | MEN1 (0.33) | MEN1KMT2AS100A4MAOAKDM4E | |
| SCHEMBL21365410 | 0.78 | MEN1 (0.35) | MEN1KMT2AS100A4MAOAKDM4E | |
| SCHEMBL17951492 | 0.77 | MEN1 (0.31) | MEN1KMT2ACDC25B | |
| SCHEMBL14096683 | 0.74 | — | — | |
| SCHEMBL21257693 | 0.74 | HPGD (0.42) | MEN1KMT2AKDM4ENPC1MAPK1 | |
| SCHEMBL21953937 | 0.74 | TTR (0.35) | MEN1KMT2AKDM4ELMNAMAPT | |
| SCHEMBL21257648 | 0.74 | ALDH1A1 (0.34) | MEN1KMT2AKDM4EMAPK1 | |
| SCHEMBL26023300 | 0.73 | MAPT (0.38) | MEN1KMT2AAPAF1NPC1LMNA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114231030-B | Resin composition, resin glue solution, prepreg, laminated board and printed wiring board | 东莞联茂电子科技有限公司 | 2024-06-07 | — | — | CN | claimed |
| CN-111372372-B | Circuit material and circuit board comprising same | 广东生益科技股份有限公司 | 2023-12-22 | — | — | CN | claimed |
| CN-111253702-B | Resin composition, prepreg and circuit material using same | 广东生益科技股份有限公司 | 2023-06-06 | — | — | CN | claimed |
| CN-115302870-B | Copper-clad laminate and application thereof | 陕西生益科技有限公司 | 2024-07-09 | — | — | CN | disclosed |
| CN-114231030-B | Resin composition, resin glue solution, prepreg, laminated board and printed wiring board | 东莞联茂电子科技有限公司 | 2024-06-07 | — | — | CN | disclosed |
| CN-115302869-B | High-frequency copper-clad plate and printed circuit board comprising same | 广东生益科技股份有限公司 | 2024-05-24 | — | — | CN | disclosed |
| CN-115198563-B | Non-woven fabric and preparation method and application thereof | 广东生益科技股份有限公司 | 2024-03-08 | — | — | CN | disclosed |
| CN-111372372-B | Circuit material and circuit board comprising same | 广东生益科技股份有限公司 | 2023-12-22 | — | — | CN | disclosed |
| CN-115073864-B | Magneto-dielectric non-woven fabric prepreg, copper-clad plate containing same and application | 陕西生益科技有限公司 | 2023-11-10 | — | — | CN | disclosed |
| CN-114957893-B | Nonwoven fabric prepreg, copper-clad plate and application of nonwoven fabric prepreg and copper-clad plate | 广东生益科技股份有限公司 | 2023-11-07 | — | — | CN | disclosed |
| CN-111253702-B | Resin composition, prepreg and circuit material using same | 广东生益科技股份有限公司 | 2023-06-06 | — | — | CN | disclosed |
| CN-115302870-A | Copper-clad laminate and application thereof | 陕西生益科技有限公司 | 2022-11-08 | — | — | CN | disclosed |
| CN-115073864-A | Magnetic-dielectric non-woven fabric prepreg, copper-clad plate comprising same and application | 陕西生益科技有限公司 | 2022-09-20 | — | — | CN | disclosed |
| CN-114957893-A | Non-woven fabric prepreg, copper-clad plate and application thereof | 广东生益科技股份有限公司 | 2022-08-30 | — | — | CN | disclosed |
| CN-112552630-B | Resin composition, resin glue solution containing resin composition, prepreg, laminated board, copper-clad plate and printed circuit board | 广东生益科技股份有限公司 | 2022-03-18 | — | — | CN | disclosed |